Display Panel Wire Frit Integration Narrow Border
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Solution Overview
Problem
Current display panels face challenges in achieving a narrow border region while maintaining effective sealing, leading to bulkiness and increased space requirements, particularly in wearable electronic devices with diverse shapes and higher resolution demands.
Innovation Solution
The display panel design incorporates a base and cover substrate with display units and wires disposed between them, where at least part of the wires function as frit metal within the encapsulation region, eliminating the need for an additional frit metal layer and reducing the border width by integrating the wires as part of the frit metal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the border region is made narrow to reduce device bulkiness, then the space requirement is reduced, but the sealing effectiveness deteriorates
Solution Approach 1:
The patent merges the frit metal layer and wire structure into a unified component. The wire is integrated directly into the encapsulation region, eliminating the need for a separate frit metal layer. This consolidation allows the border region to be narrowed while maintaining both sealing functionality and electrical connectivity, thus reducing device volume without compromising reliability.
Solution Approach 2:
The wire structure serves multiple functions simultaneously: it provides electrical connectivity for display units and acts as the encapsulation member for sealing the encapsulation region. This multi-functionality allows the same component to fulfill both electrical and protective roles, enabling a narrower border design that maintains sealing effectiveness while reducing overall device dimensions.
2Reliability
If an additional frit metal layer is added to ensure sealing, then the sealing effectiveness is improved, but the border width increases
Solution Approach 1:
The patent combines the frit metal layer and wire structure into a single integrated component. The wire is positioned within the encapsulation region and serves dual purposes: electrical connection and sealing. This merger eliminates the need for a separate frit metal layer, thereby maintaining sealing effectiveness while reducing the overall border width.
Solution Approach 2:
The patent extracts the sealing function from a separate frit metal layer and integrates it into the wire structure itself. By taking out the need for an additional dedicated sealing layer and incorporating sealing capability into the existing wire component, the design achieves effective sealing with a narrower border region.
3Reliability
If the encapsulation member thickness is increased to enhance sealing, then the sealing effectiveness is improved, but the device thickness increases
Solution Approach 1:
The patent merges the sealing function into the wire structure itself, which is integrated into the encapsulation region. This consolidation allows the encapsulation member to achieve effective sealing through optimized material properties and structural design rather than increased thickness, thereby maintaining sealing effectiveness while reducing overall device thickness.
Solution Approach 2:
The patent changes the material parameters and structural configuration of the encapsulation member rather than increasing its thickness. By optimizing the material composition and structural design of the integrated wire-encapsulation component, effective sealing is achieved with a thinner profile, thus reducing device thickness while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a narrower border region without compromising sealing effectiveness, enhancing adhesive force and reducing the thickness of the encapsulation member, thus addressing the bulkiness and space constraints in wearable devices.
Implementation Method 1
an encapsulation member disposed in the border region... configured to bond and fix the base substrate to the cover substrate
Data Source
AI summary
A display panel and an electronic device are provided. The display panel comprises a base substrate including a display region and a border region surrounding the display region, wherein the border region includes an encapsulation region; a plurality of display units disposed in the display region; an encapsulation member disposed in the border region; a plurality of wires disposed in the border region; and a cover substrate arranged opposite to the base substrate. The display units and the wires are disposed between the base substrate and the cover substrate, the encapsulation member is disposed in the encapsulation region and configured to bond and fix the base substrate to the cover substrate, and at least one of the wires is disposed in the encapsulation region.