Display Panel Bonding Terminal Structure to Prevent Surrounding Wire Peeling
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Solution Overview
Problem
The peeling of surrounding wires on existing display panels occurs when removing the protective layer, leading to broken circuits or poor bonding.
Innovation Solution
A display panel design featuring a substrate with a first surface, a second surface, and a side surface, including bonding terminals with defined height differences and grooves, allows for the formation of a suspended area under the protective layer, ensuring the surrounding wire remains intact during removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a protective layer is attached on the front surface and back surface of the display panel before preparing surrounding wires, then the display panel is protected, but a peeling phenomenon occurs to the surrounding wires when peeling the protective layer
Solution Approach 1:
The patent applies preliminary action by forming a groove structure on the substrate surface before attaching the protective layer. This groove structure pre-defines a separation path that prevents the protective layer from adhering to the surrounding wires during the peeling process, thereby avoiding wire peeling while maintaining protective layer adhesion.
Solution Approach 2:
The patent segments the contact area between the protective layer and substrate by introducing grooves. This segmentation creates distinct regions where the protective layer can be cleanly separated from the surrounding wires, preventing peeling while maintaining overall adhesion strength.
2Ease of manufacture
If a whole layer of surrounding conductive film is formed by sputtering, then the surrounding wires are created, but the conductive film covers the protective layer causing peeling when removed
Solution Approach 1:
The patent segments the conductive film deposition area by using groove structures to define specific regions. The surrounding conductive film is formed only in the groove areas, not covering the protective layer, which prevents peeling while maintaining ease of manufacture through selective deposition.
Solution Approach 2:
The patent applies local quality by forming the surrounding conductive film only in specific groove regions rather than as a whole layer. This localized deposition ensures the conductive film is created where needed without covering the protective layer, preventing peeling issues while maintaining manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents the peeling of surrounding wires during the removal of the protective layer, maintaining circuit integrity and ensuring proper bonding.
Implementation Method 1
a preparing process is to form a whole layer of a surrounding conductive film by sputtering first
Implementation Method 2
form the surrounding wires by using a laser engraving process
Data Source
AI summary
The present application provides a display panel, a manufacturing method thereof, and a display device. By defining a first height difference between a first terminal part and a second terminal part of a first bonding terminal, so that after attaching a protective layer, a suspended area is defined between the protective layer and the first terminal part, so that when preparing a surrounding wire, a metal conductive thin film is disconnected in the suspended area, thus the surrounding wire will not be lifted when the protective layer is removed, so as to alleviate a problem of peeling of a surrounding wire of existing display panels when removing a protective layer.