Display Substrate Partition Layout for Precise Micro-LED Self-Assembly
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Solution Overview
Problem
In the self-assembly method for transferring ultra-small light emitting diodes onto display device substrates, issues arise such as reduced assembly rate, increased material costs, assembly errors, and productivity losses due to LEDs being attached to partition walls, which disrupt the flow of other LEDs and require additional removal processes.
Innovation Solution
The implementation of a substrate design with distinct thickness partitions and protrusions, where the second partition in non-assembly areas has a greater thickness than the first partition in assembly areas, preventing LEDs from being attached to the partition surfaces and allowing for precise assembly within designated holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the self-assembly method is used to transfer light-emitting devices onto the substrate, then the transfer speed and accuracy are improved, but light-emitting devices may be attached to partition walls causing assembly errors and reduced productivity
Solution Approach 1:
The partition structure is designed with different thicknesses in different regions: the first partition region has a smaller thickness that allows light-emitting devices to pass through and be assembled, while the second partition region has a larger thickness that prevents device attachment. This local differentiation enables the partition to simultaneously guide device flow and prevent erroneous attachment, resolving the contradiction between transfer speed and assembly accuracy.
2Reliability
If light-emitting devices are attached to partition walls, then the dielectrophoretic force effectively guides devices, but the assembly rate is reduced due to flow interruption and blocking
Solution Approach 1:
The partition is designed with spatially varying thickness: the first partition region (smaller thickness) allows devices to pass through freely maintaining high assembly rate, while the second partition region (larger thickness) provides sufficient dielectrophoretic force for effective guidance. This local differentiation ensures both guidance effectiveness and high productivity without device blocking.
3Manufacturing precision
If a process for removing attached light-emitting devices is added, then assembly errors are corrected, but the manufacturing process becomes complicated and time increases
Solution Approach 1:
The partition structure is pre-designed with differentiated thicknesses to prevent light-emitting devices from attaching to partition walls in the first place. The second partition region's larger thickness creates a barrier that stops devices before they can attach, eliminating the need for subsequent removal processes. This preliminary preventive design maintains high assembly accuracy while keeping the manufacturing process simple and efficient.
4Manufacturing precision
If the partition thickness is increased to prevent LED attachment, then assembly accuracy is improved, but the dielectrophoretic force effectiveness is reduced
Solution Approach 1:
The partition employs local quality differentiation with two distinct thickness regions: the first partition region maintains smaller thickness to preserve strong dielectrophoretic force for effective device guidance, while the second partition region uses larger thickness to prevent device attachment and ensure assembly accuracy. This spatial differentiation allows both force effectiveness and assembly precision to coexist.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the assembly rate by preventing LED interference, reduces material waste, minimizes assembly errors, and simplifies the manufacturing process by eliminating the need for additional removal steps, thereby improving overall productivity.
Implementation Method 1
LEDs 5a and 5b are assembled in the assembly holes 3a, 3b by the dielectrophoretic force F formed between the first assembly wiring 2a and the second assembly wiring 2b
Data Source
AI summary
The display device may include a substrate having a plurality of assembly areas and non-assembly areas, a first partition arranged on a plurality of assembly areas and having an assembly hole, a second partition disposed on the non-assembly areas and a semiconductor light emitting device in the assembly hole, wherein a thickness of the second partition is greater than the thickness of the first partition.