Display Panel Rear Structure With PCB Heat-Dissipating Air Gaps
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Solution Overview
Problem
Display devices face issues with heat concentration on specific areas due to printed circuit boards, leading to potential damage and reduced display quality, as high heat from components like PMICs can cause temperature deviations and color differences.
Innovation Solution
Incorporating a cover bottom with a heat dissipating portion and air gaps between the printed circuit board and the display panel to dissipate heat evenly, reducing the concentration of heat on specific areas and minimizing temperature deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the printed circuit board is disposed close to the display panel to reduce device thickness, then the device structure is compact, but heat concentration occurs on specific areas causing temperature deviations and display quality degradation
Solution Approach 1:
The cover bottom is designed with differentiated local structures: a heat dissipating portion with convex shape disposed close to the printed circuit board for heat absorption, and a non-heat dissipating portion maintained at a distance from the display panel. This local quality differentiation enables targeted heat management while preserving display quality in critical areas.
Solution Approach 2:
The cover bottom acts as an intermediary component between the printed circuit board and the display panel. It introduces air gaps at strategic locations to inhibit direct heat transfer, while its convex heat dissipating portion actively manages heat from the PCB, thus mediating the thermal interaction between these components.
2Temperature
If air gaps are introduced to reduce heat transfer, then heat concentration is reduced, but the device structure becomes more complex
Solution Approach 1:
The cover bottom performs multiple functions simultaneously: it provides structural support for the display device, creates air gaps for thermal isolation, and incorporates a heat dissipating portion for active heat management. This multi-functionality reduces the need for additional dedicated components, thereby limiting structural complexity while achieving heat concentration reduction.
3Ease of manufacture
If the cover bottom is disposed close to the printed circuit board to improve assembly simplicity, then manufacturing is easier, but heat generated from the PCB directly affects the display panel
Solution Approach 1:
The cover bottom implements local quality differentiation by creating a convex heat dissipating portion that is disposed close to the printed circuit board for heat absorption, while maintaining a distance from the display panel through air gaps. This localized structural variation enables selective heat management: close proximity to PCB for heat dissipation where needed, and distance from display panel to prevent heat transfer where harmful.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively disperses heat generated by the printed circuit board, reducing temperature deviations and maintaining display quality by preventing heat concentration on specific areas, thus enhancing the overall performance and reliability of the display device.
Implementation Method 1
the cover bottom includes a heat dissipating portion disposed in the cover bottom, and the printed circuit board is disposed on the heat dissipating portion, and one or more air gaps are formed between the heat dissipating portion and at least one of the display panel and the printed circuit board
Implementation Method 2
one or more air gaps are formed between the heat dissipating portion and at least one of the display panel and the printed circuit board
Implementation Method 3
the cover bottom includes a convex portion protruding towards the printed circuit board, and the convex portion accommodates at least one air gap
Data Source
AI summary
A display device includes a display panel, a cover bottom disposed on a rear surface of the display panel, and a printed circuit board disposed on a rear surface of the cover bottom and including a plurality of elements to drive the display panel, wherein the cover bottom includes a heat dissipating portion disposed in the cover bottom, and the printed circuit board is disposed on the heat dissipating portion, and one or more air gaps are formed between the heat dissipating portion and at least one of the display panel and the printed circuit board.