Display Driver PCB Layout Without Vias to Minimize EMI
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Solution Overview
Problem
Existing display technologies face challenges with electromagnetic interference (EMI) and noise due to via holes in PCB designs of display driving modules, particularly when controlling high-resolution LED displays with dense pixel arrangements, leading to increased fabrication difficulty.
Innovation Solution
A new PCB design for display driving modules where driver ICs and scan ICs are arranged in parallel and connected through parallel circuits, eliminating the need for via holes and minimizing EMI by ensuring conductive wires do not intersect, thereby reducing power consumption and heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If via holes are used to bypass crossing wires in PCB layers, then wire routing flexibility is improved, but electromagnetic interference and noise increase
Solution Approach 1:
The patent extracts and eliminates the via hole component from the PCB design. By removing via holes entirely and using only planar copper traces on the PCB surface, the design achieves wire routing without vertical penetrations, thus eliminating EMI while maintaining routing flexibility through strategic IC placement and trace design
Solution Approach 2:
The patent transitions from three-dimensional wire routing (using via holes to cross between PCB layers) to two-dimensional planar routing. All connections are made using copper traces on the PCB surface without vertical transitions, converting a 3D routing problem into a 2D solution that avoids EMI from vertical wire passages
2Adaptability or versatility
If via holes are formed in PCB, then wire crossing between layers is enabled, but fabrication difficulty increases
Solution Approach 1:
The patent removes via holes from the PCB fabrication process entirely. The design uses only planar copper traces and surface-mounted ICs, eliminating the need for drilling, plating, and forming via holes, thus simplifying fabrication while maintaining wire crossing capability through strategic routing on the PCB surface
3Object-affected harmful factors
If driver ICs and scan ICs are connected through parallel circuits without via holes, then electromagnetic interference is minimized, but PCB design complexity increases
Solution Approach 1:
The patent segments the driver ICs and scan ICs into separate, systematically arranged groups on the PCB. By dividing the ICs into distinct sections with dedicated copper trace routing patterns, the design achieves organized signal distribution without via holes, reducing EMI while managing complexity through modular layout
Solution Approach 2:
The patent changes the routing parameter from vertical 3D connections via via holes to horizontal 2D connections using copper traces. This parameter change in connection geometry eliminates EMI from vertical wire passages while the systematic arrangement of ICs and traces manages the resulting PCB layout complexity
Data Source
AI summary
Discussed is a driving module including a PCB having a plurality of circuit printed layers, a plurality of driver ICs attached to the PCB to transmit at least one signal, a plurality of scan ICs attached to the PCB in a manner of being located at positions different from those of a plurality of the driver ICs, a driver circuit connecting a first driver IC and a second driver IC among a plurality of the driver ICs together in a first direction, a scan circuit connecting a first scan IC and a second scan IC among a plurality of the scan ICs together in the first direction, and a controller controlling at least one of a plurality of the driver ICs, a plurality of the scan ICs, the driver circuit, or the scan circuit.