Vehicle Display PCB Shield Structure for Heat and Contamination

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Solution Overview

Problem

Display apparatuses in vehicles face issues with heat dissipation and foreign substance contamination, leading to malfunction and electrical shorts due to harsh environmental conditions such as extreme temperatures and vibrations.

Innovation Solution

A display apparatus design featuring a guide plate on the rear surface of the display panel, a printed circuit board on the top surface, and a cover shield composed of multiple layers with strategically formed holes for heat dissipation and protection against foreign substances, which is attached to the guide plate for enhanced stability and grounding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the display apparatus is placed in a vehicle environment, then it can be used in diverse applications (infotainment, navigation, instrument panels), but it is exposed to extreme temperatures and heat from the engine compartment causing malfunction

Engineering Contradiction:
Improveapplication rangeVSAvoidoperational stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

A heat dissipation structure is introduced as an intermediary component between the display apparatus and the harsh vehicle environment (engine compartment heat). This structure actively manages thermal energy transfer, preventing excessive heat from reaching the display components while allowing the display to maintain its versatile applications in various vehicle locations including the dashboard.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If components are integrated in the display apparatus, then functionality is enhanced, but heat generated by components accumulates causing abnormal operation

Engineering Contradiction:
Improvefunctional integrationVSAvoidheat accumulation
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The heat dissipation structure segments the internal space of the display apparatus into distinct thermal zones. By creating separate pathways and channels within the housing, it divides the accumulated heat into manageable sections that can be efficiently directed toward external dissipation points, preventing heat concentration around integrated components while maintaining functional integration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat dissipation structure utilizes air flow (pneumatic principle) to remove heat from the display apparatus. Channels and openings are designed to facilitate natural or forced convection of air through the housing, creating a pneumatic cooling system that continuously replaces hot air with cooler ambient air, thereby managing heat from integrated components without compromising their functional integration.

Inventive Principle:
Principle #29Pneumatics and hydraulics

3Ease of manufacture

If the printed circuit board is exposed to foreign substances in the vehicle environment, then manufacturing is simplified, but electrical shorts occur due to conductive contamination

Engineering Contradiction:
Improveassembly simplicityVSAvoidelectrical safety
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A protective film or coating is applied to the printed circuit board as a thin barrier layer. This flexible protective layer conformally covers the PCB surface and conductive traces, preventing foreign substances (dust, moisture, conductive contaminants) from the vehicle environment from contacting the electrical components, thereby maintaining electrical safety while allowing the PCB to remain exposed for manufacturing purposes.

Inventive Principle:
Principle #30Flexible shells and thin films

4Reliability

If a protective structure is added to prevent heat and foreign substances, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improveoperational stabilityVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The heat dissipation structure is designed to perform multiple functions simultaneously: it serves as both the structural housing of the display apparatus and the thermal management system. By integrating the protective shell and heat dissipation channels into a single unified structure, it provides both mechanical protection against foreign substances and active heat dissipation, thereby improving reliability without proportionally increasing structural complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat generated by components, prevents electrical shorts, and protects the printed circuit board from foreign substances, ensuring stable operation and reduced power consumption in harsh vehicle environments.

Implementation Method 1

a cover shield configured to cover the printed circuit board and the component

Methodology Applied
Scientific EffectHeat dissipation: Convection

Implementation Method 2

effectively dissipates heat generated by components

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS11812594B2Display apparatus
Publication Date: 2023.11.07 LG DISPLAY CO LTD
  • US11812594B2 patent drawing
  • US11812594B2 patent drawing
  • US11812594B2 patent drawing

AI summary

The present disclosure provides a display apparatus. The display apparatus includes a display module including a display panel and a guide plate, a flexible printed circuit board extending from the display panel, a source printed circuit board connected to the flexible printed circuit board and attached to the guide plate, at least one driving chip disposed on the source printed circuit board, and a protective member disposed to cover the flexible printed circuit board, the source printed circuit board, and the driving chip.