Display Panel Pin Arrangement for Thermal Expansion Compensation
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Solution Overview
Problem
The bonding of pins between driving chips and substrate pads in display panels often results in shape deformation and positional deviations due to thermal expansion, leading to imperfect bonding and low bonding rates, which impairs display quality.
Innovation Solution
The pins on the substrate are arranged with varying pitch and width in different positions within the pad regions, allowing for symmetric and adaptive bonding during thermal compression, using an Nth degree equation to optimize pin placement and minimize thermal expansion issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pins are arranged with fixed pitch and width in pad regions, then manufacturing process is simple, but thermal expansion causes shape deformation and positional deviation leading to low bonding rate
Solution Approach 1:
The patent applies local quality by varying the pin pitch and/or width at different positions within the pad region. Specifically, pins arranged with a first pitch/width in a first area and a second pitch/width in a second area, where the first pitch/width is smaller than the second pitch/width. This local variation compensates for thermal expansion effects in different regions, improving bonding accuracy without requiring complete redesign of the entire pin structure.
Solution Approach 2:
The patent changes the geometric parameters (pitch and/or width) of pins based on their position in the pad region. By adjusting these parameters locally, the design compensates for thermal expansion variations across different areas, thereby improving bonding precision while maintaining a relatively simple overall structure.
2Productivity
If uniform pin arrangement is used in pad regions, then design and manufacturing are simple, but bonding rate is low due to thermal expansion issues
Solution Approach 1:
The patent implements local quality by dividing the pad region into different areas (first area and second area) with different pin configurations. The first area has pins with a first pitch/width optimized for high-precision bonding, while the second area has pins with a second pitch/width suited for its specific thermal characteristics. This localized optimization improves overall bonding rate by addressing thermal expansion issues in each region appropriately.
3Stability of the object's composition
If pins have same dimensions throughout pad region, then manufacturing is easier, but shape deformation occurs during thermal compression process
Solution Approach 1:
The patent applies local quality by assigning different pitch and/or width dimensions to pins in different areas of the pad region. Pins in the first area have a first pitch/width that maintains shape stability under thermal compression, while pins in the second area have a second pitch/width optimized for their local thermal conditions. This localized differentiation improves pin shape stability during the bonding process.
Solution Approach 2:
The patent changes the geometric parameters (pitch and/or width) of pins based on their specific location in the pad region. By adjusting these parameters locally rather than using uniform dimensions, the design compensates for variations in thermal expansion across different areas, thereby improving shape stability during thermal compression while keeping manufacturing complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement significantly improves the bonding rate of pins, reducing rework costs and labor, and increasing the yield of display panels by ensuring accurate and reliable connections despite thermal expansion.
Implementation Method 1
due to material properties of the pins 122 and 132, when the pins 132 of the driving chips 130 and the pins 122 in each of the pad regions 120 are bonded through implementing a thermal compression process, the pins 122 may encounter quality issues related to shape deformation, positional deviation, etc.
Data Source
AI summary
A display panel including a substrate and many driving chips is provided. The substrate has many pad regions located in a non-display region of the substrate. Each pad region has many first pins with the same length disposed therein, and a pin pitch between two adjacent first pins, a width of each of the first pins, or both the pin pitch and the width vary with the positions where the first pins are disposed in the corresponding pad region. The driving chips are disposed in the non-display region of the substrate. Each driving chip has many second pins, and each second pin is electrically connected to each first pin correspondingly.