Display Pixel Backup Bonding Structure for High-Density Quality Control
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Solution Overview
Problem
Display devices using light-emitting diodes often require patch space due to inconsistent quality, affecting yield and resolution.
Innovation Solution
Incorporation of a backup bonding portion in the display device structure that can be patched to replace malfunctioning sub-pixels, maintaining high resolution and pixel density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If light-emitting diodes are batch bonded to pixel layout, then manufacturing efficiency is improved, but display quality deteriorates due to inconsistent LED quality
Solution Approach 1:
The patent pre-configures backup bonding portions alongside normal bonding portions during the initial manufacturing process. These backup portions are prepared in advance with complete electrode structures and metal patterns, ready to immediately replace any defective LEDs without requiring additional manufacturing steps later. This preliminary preparation resolves the contradiction by maintaining batch bonding efficiency while ensuring quality through pre-positioned replacements.
Solution Approach 2:
The patent introduces a state change mechanism where bonding portions can transition from normal display function to patch function. By designing the backup bonding portions with identical structural parameters but different functional states, the system can switch between high-efficiency normal operation and quality-corrected patch operation, resolving the contradiction between manufacturing efficiency and display quality.
2Reliability
If patch space is reserved for quality control, then display quality is improved, but pixel density deteriorates
Solution Approach 1:
The backup bonding portions are designed with the same structural parameters as normal bonding portions, including identical electrode sizes, metal pattern dimensions, and sub-pixel layouts. This multi-functionality allows the same structural template to serve both normal display pixels and backup patch pixels, eliminating the need for separate patch space and maintaining high pixel density while ensuring display quality.
Solution Approach 2:
The patent merges the backup bonding portion structure with the normal bonding portion structure, making them indistinguishable in terms of physical dimensions and electrical connections. By combining these functions into a unified structural design, the system achieves both quality control and high pixel density without sacrificing one for the other.
3Productivity
If backup bonding portion is added for patching, then yield rate is improved, but device complexity increases
Solution Approach 1:
The patent segments the bonding process into normal bonding portions and backup bonding portions, each with independent electrode structures and metal patterns. This segmentation allows defective portions to be identified and replaced individually without affecting the entire display, improving yield rate while maintaining manageable structural complexity through modular design.
Solution Approach 2:
The backup bonding portions are created as exact copies of the normal bonding portions, including identical electrode geometries, metal pattern layouts, and connection structures. This copying approach simplifies the overall design by using a standardized template, reducing the complexity burden that would otherwise arise from designing unique patch structures.
4Quantity of substance
If multiple sub-pixels share backup bonding portion, then pixel density is improved, but manufacturing precision requirements increase
Solution Approach 1:
The shared backup bonding portion is designed with universal electrode structures and metal patterns that can accommodate multiple sub-pixels. By creating a multi-functional backup structure that serves several sub-pixels simultaneously, the system achieves high pixel density while the standardized design actually reduces manufacturing precision requirements compared to unique custom patch structures for each sub-pixel.
Data Source
AI summary
A display device includes a first pixel, a second pixel, and a backup bonding portion. The first pixel includes a first sub-pixel and a second sub-pixel corresponding to two first bonding portions. The second pixel includes a third sub-pixel and a fourth sub-pixel corresponding to two second bonding portions. Each of the two first bonding portions and two second bonding portions includes a first electrode and a second electrode. The backup bonding portion is proximate to the first and second pixels and electrically connected to an extension portion. The backup bonding portion includes a first electrode and a second electrode. The first electrode of one first bonding portion is electrically connected to a first metal pattern. The first electrode of one second bonding portion is electrically connected to a second metal pattern. The extension portion overlaps at least one of the first metal pattern and the second metal pattern.