Display Pixel Active-Layer Layout for High-Resolution Yield
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Solution Overview
Problem
The reduction in pixel layout space in display devices due to increased resolution requirements affects manufacturing processes, leading to yield issues.
Innovation Solution
A specific design for the mask used in the manufacturing process, incorporating an arc-shaped edge between adjacent active layer ends and a metal line overlap in the insulating layer, to mitigate the impact of reduced pixel layout space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the resolution of display devices is increased, then the display quality is improved, but the layout space of pixels is reduced
Solution Approach 1:
The insulating layer is designed with different thicknesses in different regions: a first thickness in the first region and a second thickness in the second region. This local variation in thickness allows the structure to accommodate high resolution requirements while maintaining sufficient layout space for manufacturing processes in different areas of the pixel
2Measurement precision
If the layout space of pixels is reduced, then the resolution is improved, but the manufacturing process yield is affected
Solution Approach 1:
The insulating layer with varying thickness is formed in advance before subsequent manufacturing steps. This preliminary structuring creates built-in spacing and alignment features that guide later processing steps, making the manufacturing process more robust against the constraints of reduced pixel layout space
3Measurement precision
If the pixel layout is optimized for high resolution, then the display quality is improved, but the manufacturing complexity increases
Solution Approach 1:
The insulating layer serves multiple functions: it provides electrical insulation, defines pixel boundaries, creates alignment references for subsequent layers, and maintains structural integrity. This multi-functionality reduces the need for additional separate components or steps, thereby managing manufacturing complexity despite high resolution requirements
Data Source
AI summary
An electronic device includes a substrate, a first active layer, a second active layer, an insulating layer and a metal line. The first active layer is disposed on the substrate and includes a first end. The second active layer is disposed on the substrate and includes a second end, wherein the second end is adjacent to the first end. The insulating layer is disposed on the first active layer and the second active layer. The metal line is disposed on the insulating layer. In a cross-sectional view of the electronic device, the insulating layer includes a first opening, and a portion of the metal line is disposed in the first opening and overlapped with the first end, and in a top view of the electronic device, the first end has an edge, a portion of the edge is arc-shaped and located between the first opening and the second end.