Display Module Protruding Encapsulation Layer Circuit Board Bonding
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Solution Overview
Problem
As the bezel area in display devices is reduced to enlarge the display area, the bonding process of circuit boards to the bezel area can damage elements in the display area, compromising the reliability of the display device.
Innovation Solution
The display device incorporates a substrate with a display area and a bezel area, featuring an encapsulation layer with a protruding part that overlaps the bezel area, allowing for separate circuit boards to be positioned adjacent to the side surfaces, reducing the risk of damage during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the bezel area is reduced to enlarge the display area, then the display area is enlarged, but the area available for circuit board bonding is reduced, causing damage to display elements during bonding
Solution Approach 1:
The circuit board is divided into two separate parts: a first circuit board bonded to the bezel area and a second circuit board bonded to the protruding part of the encapsulation layer. This segmentation allows each circuit board to be bonded to a dedicated bonding area, preventing damage to display elements while maintaining electrical connectivity.
Solution Approach 2:
The encapsulation layer is designed with a protruding part that extends in the third direction (thickness direction) from the main part. This dimensional change creates a new bonding surface on the protruding part, providing additional bonding area without increasing the planar footprint in the first and second directions, thus avoiding encroachment on the display area.
2Ease of manufacture
If a single circuit board is bonded to the bezel area, then the bonding process is simple, but display elements may be damaged during bonding
Solution Approach 1:
The circuit board function is segmented into two separate circuit boards bonded to different locations. The first circuit board handles connections to the display element layer through pad portions on the substrate, while the second circuit board handles connections to the input sensing unit through pad portions on the protruding part. This segmentation isolates the bonding processes to avoid damage while maintaining manufacturing feasibility.
3Device complexity
If the encapsulation layer covers only the display element layer, then the structure is simple, but there is no dedicated bonding area separated from the display area
Solution Approach 1:
The encapsulation layer is configured with a main part covering the display element layer and a protruding part extending in the third direction from the main part. This three-dimensional configuration creates a dedicated bonding area on the protruding part that is spatially separated from the display area in the planar directions, providing a safe bonding zone without significantly increasing overall device complexity.
Data Source
AI summary
A display device includes a substrate including an upper surface, a lower surface, and side surfaces; a display element layer on the upper surface overlapping the display area; an encapsulation layer on the upper surface, the encapsulation layer including a main part that overlaps the display element layer and a protruding part that protrudes along a first direction from the main part and overlaps the bezel area; an input sensor on the main part; a first circuit board facing the main part, overlapping the bezel area, and on the upper surface; and a second circuit board on the protruding part, wherein each of the first circuit board and the second circuit board is adjacent to a first side surface among the side surfaces, and in the first direction, the protruding part is more adjacent to the first side surface than the main part.