Display Repair Pad Layout for Replacing Defective Light Emitters
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Solution Overview
Problem
Manufacturers face challenges in improving the repair technique for self-luminous light emitting elements in display devices, leading to reduced fabrication yield due to defective units.
Innovation Solution
A method for manufacturing electronic devices that involves providing a substrate with connecting pads and conductive portions, forming conductive lines, and bonding light emitting units, with an insulating layer between the pads and conductive portions, allowing for the identification and replacement of defective units using a repairing light emitting unit bonded with a second material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-luminous light emitting elements are disposed in the display device, then light source and image display functions are provided, but defective light emitting elements are detected leading to reduced fabrication yield
Solution Approach 1:
The patent forms redundant connecting pads and conductive portions before bonding the light emitting units. This preliminary preparation of backup connection structures allows defective units to be replaced without requiring rework of the entire assembly, thereby improving fabrication yield while maintaining reliability
Solution Approach 2:
The patent enables the discarding of defective light emitting elements and their replacement with functional ones by providing redundant connecting pads. The redundant structures are recovered and utilized when defects are detected, allowing continuous production without complete assembly rejection
2Ease of repair
If redundant connecting pads and conductive portions are formed, then defective units can be replaced, but device structure becomes more complex
Solution Approach 1:
The patent segments the connection structure into primary and redundant connecting pads, as well as primary and conductive portions. This segmentation allows the redundant elements to be independently activated only when needed for replacement, reducing the impact of added complexity while improving repairability
Solution Approach 2:
The patent positions the redundant connecting pads and conductive portions in overlapping spatial relationships with the primary structures. This dimensional arrangement allows the redundant elements to serve as backups without significantly increasing the overall device footprint or structural complexity
Data Source
AI summary
A method for manufacturing an electronic device includes: providing a substrate; forming a plurality of connecting pads and a plurality of conductive portions partially overlapped by the plurality of connecting pads on the substrate; forming a plurality of conductive lines on the substrate, wherein one of the plurality of conductive lines is partially overlapped with one of the plurality of conductive portions, and an insulating layer is disposed between one of the plurality of connecting pads and the one of the plurality of conductive portions; and bonding a plurality of light emitting units to the plurality of connecting pads.