Display-Integrated RF Antenna Module for Low-Power 5G Transmission
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Solution Overview
Problem
The challenge of miniaturizing radio frequency (RF) components in wireless communication devices is exacerbated by high transmission power requirements, leading to increased power consumption and difficulty in achieving effective radio transmission performance, particularly in power amplifiers.
Innovation Solution
A radio frequency (RF) system comprising multiple phase shift and gain control single chip circuits, power amplifiers, and antennas, which adjust and amplify RF signals, allowing for efficient transmission and reception of RF signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power amplifiers are miniaturized to reduce device size, then device size decreases, but transmission performance deteriorates due to high transmission power requirements
Solution Approach 1:
The patent divides the power amplifier system into multiple parallel power amplifier chips (first power amplifier chip, second power amplifier chip, etc.), each handling a portion of the total transmission power. This segmentation allows each chip to be smaller while collectively achieving the required transmission performance, thus resolving the contradiction between miniaturization and transmission effectiveness.
2Reliability
If transmission power is increased to improve radio transmission performance, then transmission effectiveness improves, but power consumption increases
Solution Approach 1:
The system uses multiple power amplifier chips connected in parallel, where each chip operates at a lower individual power level. The control circuit independently controls the power output of each chip, allowing the system to achieve high transmission performance through coordinated operation while managing overall power consumption more effectively than a single high-power amplifier.
3Reliability
If multiple power amplifiers are used to improve transmission performance, then radio transmission effectiveness improves, but device complexity increases
Solution Approach 1:
The patent integrates multiple power amplifier chips and the control circuit onto a single substrate, merging what would otherwise be separate discrete components into a unified integrated system. This integration reduces the overall device complexity by eliminating the need for separate packaging and interconnections between multiple independent amplifier units while maintaining the parallel architecture benefits.
Data Source
AI summary
The wireless RF semiconductor system is described for use in wireless communication devices that operate in frequency range from 6 GHz to 100 GHz. The system comprises of at least one RF antenna and at least one active RF component fabricated (or built) on the same semiconductor substrate inside a one single packaged module. The wireless RF semiconductor system is described in a variety of different configurations with its functionality divided up over several single chip circuits. The system simplifies assembly, reduces size and cost, and allows for a quick time to market, while maximizing the RF performance demanded by fixed and mobile 4G, 5G and other wireless standards.