Display Substrate Routing Layout for Dense Under-Panel Camera Wiring
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Solution Overview
Problem
Existing display technologies require multiple layers of ITO routing wires for camera under panel designs, leading to increased manufacturing costs and complexity due to the limited distribution of routing wires on each layer, which are constrained by minimum wire width and space requirements, making mass production difficult.
Innovation Solution
A display substrate design that incorporates a first wire routing layer with routing wires spaced less than 2 um apart, using an insulation layer to reduce the number of layers and masks, allowing for more efficient wire distribution and reduced manufacturing costs by employing an insulation layer with higher exposure resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple layers of ITO routing wires are used for camera under panel design, then the routing coverage is improved, but the manufacturing cost and complexity increase
Solution Approach 1:
The patent transitions from planar routing wire arrangement to three-dimensional arrangement by stacking routing wires vertically across multiple layers. This dimensional change allows routing wires to be distributed in the thickness direction of the substrate, significantly increasing routing coverage without proportionally increasing manufacturing complexity.
Solution Approach 2:
The patent divides the routing wire structure into multiple independent layers, with each layer containing a subset of routing wires. This segmentation allows for modular manufacturing where each layer can be processed separately, reducing the overall complexity compared to creating a single complex planar routing layer.
2Manufacturing precision
If routing wires are spaced according to minimum wire width and space requirements, then manufacturing feasibility is maintained, but the number of routing wires per layer is limited
Solution Approach 1:
By arranging routing wires in multiple vertical layers rather than spreading them out in a single planar layer, the patent increases the total number of routing wires that can be accommodated within the same footprint. This vertical stacking allows denser wire distribution while maintaining the required minimum spacing and width specifications for manufacturability.
Data Source
AI summary
Embodiments of the disclosure disclose a display substrate, a manufacturing method thereof and a display apparatus. The display substrate includes: a base, having a wire routing region; a first wire routing layer, located on the base, where the first wire routing layer in the wire routing region includes a plurality of first routing wires arranged at intervals, and a space between adjacent first routing wires is smaller than 2 um; an insulation layer, located on a side of the first wire routing layer facing away from the base and having a plurality of first via holes corresponding to the first routing wires; a first flat layer, located on a side of the insulation layer facing away from the base and having second via holes corresponding to the first via holes, where the second via holes at least partially overlap with the first via holes.