Light Emitting Display Substrate Routing Line Embedding

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Solution Overview

Problem

In light emitting display panels, routing lines protruding from the lateral and rear surfaces are prone to damage due to contact with various structures, which can lead to defects and reduced electrical connectivity.

Innovation Solution

A light emitting display apparatus design where the thickness of the base substrate in pad portions connected to routing lines is reduced compared to other regions, with the routing lines being embedded in engraved patterns on the substrates to minimize contact and enhance electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If routing lines are provided on lateral surfaces to eliminate non-display area, then user immersion is improved, but routing lines protrude and contact various structures causing damage

Engineering Contradiction:
Improvenon-display area widthVSAvoidrouting line integrity
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The routing lines are embedded within engraved patterns formed on the lateral surfaces of the first and second base substrates. This nesting approach allows the routing lines to be housed inside protective grooves rather than protruding on the surface, eliminating contact with external structures while maintaining the eliminated non-display area benefit.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The routing lines are positioned within engraved patterns that create depth variations on the substrate surfaces. By utilizing the vertical dimension through engraving depth, the routing lines are protected from lateral contact while maintaining electrical connectivity, transforming a surface-level vulnerability into a protected three-dimensional structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If thickness of base substrate in pad portion is reduced, then routing line damage risk is reduced, but substrate strength may be compromised

Engineering Contradiction:
Improverouting line protectionVSAvoidsubstrate mechanical strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The base substrate thickness is selectively reduced only in the pad portions where routing lines are embedded, while other regions maintain their original thickness. This localized thinning approach provides routing line protection through reduced protrusion height while preserving the overall mechanical strength of the substrate structure in non-critical areas.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The base substrate is divided into regions with different thicknesses: thinner pad portions for routing line embedding and thicker regions for structural support. This segmentation allows the substrate to simultaneously achieve routing line protection and maintain adequate mechanical strength through differential thickness design.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20230217746A1Light emitting display apparatus
Publication Date: 2023.07.06 LG DISPLAY CO LTD
  • US20230217746A1 patent drawing
  • US20230217746A1 patent drawing
  • US20230217746A1 patent drawing

AI summary

A light emitting display apparatus includes a first base substrate including a first pad portion including a first pad connected to a routing line, a display area, and a first boundary region provided between the display area and the first pad portion and a second base substrate including a second pad portion including a second pad connected to the routing line, a connection region where a link line is provided, and a second boundary region provided between the connection region and the second pad portion. The second base substrate is bonded to a rear surface of the first base substrate, a thickness of the first base substrate in the first pad portion is less than a thickness of the first base substrate in the first boundary region, and a thickness of the second base substrate in the second pad portion is less than a thickness of the second base substrate in the second boundary region.