Display Device Scan Driver Routing via Insulating Layers

The patent applies multi-layer stacking to route connection lines through different vertical levels (first, second, and third connection lines in different layers), allowing signals to traverse the display panel without requiring additional horizontal space. This vertical dimensionality resolves the layout complexity by enabling compact routing of multiple connection paths within the constrained non-display area.

The patent implements nested routing where connection lines are organized in hierarchical layers with insulating layers positioned between them. The first connection lines are routed in an outer region while second connection lines are routed in an inner region, creating a nested spatial arrangement that efficiently packs multiple connection paths into the limited non-display area without mutual interference.

The patent eliminates signal interference by routing different connection lines through different vertical layers separated by insulating layers. The first connection lines, second connection lines, and scan/drain lines are positioned at different heights, transforming a two-dimensional routing problem into a three-dimensional solution that prevents electromagnetic coupling between adjacent lines.

The patent introduces insulating layers as intermediary barriers between different connection lines and signal lines. These insulating layers act as electromagnetic shields that prevent direct coupling and interference between the first connection lines, second connection lines, and scan/drain lines while allowing all lines to coexist in the compact non-display area.

The patent reduces manufacturing complexity by distributing connection lines across multiple vertical layers rather than packing them tightly in a single plane. This vertical separation provides greater tolerance for lateral alignment variations during fabrication, as the critical spacing is in the vertical dimension (controlled by insulating layer thickness) rather than the horizontal dimension.

The patent implements a nested regional arrangement where first connection lines are confined to an outer region and second connection lines are confined to an inner region, with insulating layers providing clear spatial delimitation. This regional nesting simplifies manufacturing by defining distinct fabrication zones with different routing patterns, reducing the overall alignment precision requirements compared to uniform dense packing.