Display Seal Wall Structure for Narrow-Bezel ESD Protection
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Solution Overview
Problem
The narrow border design in electronic devices makes it difficult to prevent conductive sealant from penetrating into the substrate, leading to electrostatic discharge failures by allowing the sealant to infiltrate the circuit area.
Innovation Solution
An electronic device design featuring a wall structure positioned between the sealant frame and the conductive member in the peripheral area, which blocks the conductive sealant from flowing into the active area, thereby preventing infiltration and potential panel cutting failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the peripheral area size is reduced to achieve narrow border design, then the aesthetic appearance and compactness are improved, but the conductive sealant easily penetrates into the substrate causing electrostatic discharge failures
Solution Approach 1:
The patent introduces a non-conductive sealant frame as an intermediary barrier between the conductive sealant and the substrate. This non-conductive frame prevents the conductive sealant from directly contacting and penetrating into the substrate, thereby eliminating the electrostatic discharge failure while maintaining the narrow border design.
Solution Approach 2:
The patent segments the sealing structure into two distinct parts: a non-conductive sealant frame and a conductive sealant. The non-conductive sealant frame is positioned first to create a barrier, and the conductive sealant is applied subsequently. This segmentation allows each material to perform its specific function without causing harm.
2Shape
If the peripheral area size is reduced to achieve narrow border design, then the aesthetic appearance and compactness are improved, but the conductive sealant infiltration into the circuit area increases
Solution Approach 1:
The non-conductive sealant frame serves as a protective intermediary that blocks the conductive sealant from infiltrating into the circuit area. This intermediary structure maintains the narrow border aesthetic while preventing harmful infiltration.
Solution Approach 2:
The non-conductive sealant frame is applied in advance before the conductive sealant to create a preventive barrier. This preliminary anti-action stops the conductive sealant from infiltrating the circuit area before it can cause damage.
3Area of stationary object
If the sealant frame is positioned closer to the active area to reduce peripheral area, then the device compactness is improved, but the risk of panel cutting failures increases
Solution Approach 1:
The patent segments the sealing function into two parts: the non-conductive sealant frame positioned close to the active area for compactness, and the conductive sealant applied subsequently for ESD protection. This segmentation allows the sealant frame to be optimally positioned without compromising reliability.
Solution Approach 2:
The non-conductive sealant frame acts as an intermediary that can be positioned close to the active area without causing panel cutting failures, as it provides the necessary barrier function while allowing the conductive sealant to provide additional protection.
Data Source
AI summary
An electronic device is provided with an active area and a peripheral area, and includes a first substrate, a second substrate, a sealant frame, a conductive member and a wall structure. The second substrate is arranged opposite to the first substrate. The sealant frame is arranged on the first substrate and surrounds the active area. The conductive member is arranged on the peripheral area, wherein part of the conductive member is arranged between the first substrate and the second substrate. The wall structure is arranged between the first substrate and the second substrate, wherein the wall structure is arranged between the sealant frame and the conductive member when viewed in a top view direction.