Display Device Sealant Support via Bank Layer Mediator
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Solution Overview
Problem
The existing display devices face challenges in maintaining a consistent gap between substrates due to defective bonding caused by pressure applied to the sealant, leading to variations in the sealant's performance and potential moisture permeation.
Innovation Solution
The introduction of a display device design that includes a bank layer, support layer, and dummy color filters, along with a sealant positioned between the non-display part and the bank layer, helps maintain a consistent gap by providing additional structural support and preventing sealant contraction under pressure, while also using a thin film encapsulation layer to cover the pixel and extend to the non-display part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the sealant is disposed at the peripheral area of the second substrate where layers are ended, then the bonding structure is simplified, but pressure applied to the second substrate causes defective bonding between the first substrate and the second substrate
Solution Approach 1:
A support layer is introduced as an intermediary element between the sealant and the second substrate. This support layer extends from the display part into the non-display part, providing structural reinforcement to the sealant region and preventing substrate deformation under pressure, thereby ensuring reliable bonding without increasing overall device complexity
Solution Approach 2:
The support layer is formed in advance during the manufacturing process, before the bonding operation. This preliminary structural preparation ensures that when pressure is applied during bonding, the support layer is already in place to maintain the gap and prevent defective bonding, rather than attempting to correct issues after bonding fails
2Strength
If pressure is applied to the second substrate during bonding, then the substrates are bonded together, but the gap between the first substrate and the second substrate becomes non-uniform
Solution Approach 1:
The support layer acts as a mediator that maintains the designed gap between the first and second substrates during the bonding process. By extending into the non-display part, it provides mechanical support that prevents the second substrate from deforming under pressure, ensuring uniform gap maintenance while still allowing strong bonding to occur
Solution Approach 2:
The bonding structure utilizes a composite approach by combining the sealant material with the support layer structure. This composite system provides both the bonding function of the sealant and the structural support function of the support layer, enabling simultaneous achievement of strong bonding and uniform gap maintenance
3Ease of manufacture
If the sealant is positioned only at the peripheral area, then the manufacturing process is simplified, but the sealant contracts under pressure leading to moisture permeation
Solution Approach 1:
The support layer serves as a mediator that reinforces the sealant structure without complicating the manufacturing process. It provides the necessary mechanical support to prevent sealant contraction under pressure, maintaining the moisture barrier function while keeping the sealant positioning simple and peripheral
Solution Approach 2:
The support layer is segmented to extend from the display part into the non-display part, providing localized reinforcement exactly where the sealant needs support. This segmentation approach maintains manufacturing simplicity by only adding support where necessary, rather than requiring complete structural modification
Data Source
AI summary
Provided is a display device including a first substrate including a display part and a non-display part around the display part, a second substrate disposed on the first substrate, a pixel disposed between the display part and the second substrate, a quantum dot layer disposed between the second substrate and the pixel, a bank layer disposed around the quantum dot layer, and when viewed on a plane, overlapping the non-display part, a color filter disposed between the second substrate and the quantum dot layer, a dummy color filter, when viewed on the plane, overlapping the non-display part, and disposed between the bank layer and the second substrate, and a sealant disposed between the non-display part and the bank layer.