Display Device Sealing Member for Driver IC Step Compensation
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Solution Overview
Problem
Display devices with driver integrated circuits on flexible films face challenges in preventing static electricity and maintaining a secure, sealed environment due to steps formed by the driver integrated circuits, which can lead to lifting of insulating tapes and exposure of the circuits to air or resin leakage.
Innovation Solution
A display device structure that includes a sealing member surrounding the driver integrated circuit, an insulating tape attached to the sealing member, and a protective resin between the tape and the circuit board, ensuring the insulating tape forms a level surface with the sealing member and is securely attached to prevent lifting and exposure, while the sealing member compensates for the step formed by the driver integrated circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an insulating tape is disposed directly on the driver integrated circuit to prevent static electricity, then static electricity prevention is improved, but the tape may lift due to the step formed by the circuit, causing exposure and reliability degradation
Solution Approach 1:
A sealing member is introduced as an intermediary component between the driver integrated circuit and the insulating tape. The sealing member has a height that compensates for the step formed by the driver integrated circuit, providing a flat upper surface for the insulating tape to adhere to. This mediator eliminates the adhesion problem caused by the height difference while maintaining static electricity prevention functionality.
Solution Approach 2:
The sealing member extends in the vertical dimension (height direction) to compensate for the step formed by the driver integrated circuit. By adding this vertical dimension compensation, the insulating tape can be disposed on a level surface, ensuring proper adhesion while still covering the circuit for static electricity prevention.
2Object-affected harmful factors
If the insulating tape is disposed to cover the driver integrated circuit, then static electricity prevention is improved, but resin may leak through gaps formed by the step, causing contamination
Solution Approach 1:
The sealing member serves as a mediator that prevents resin leakage by providing a continuous sealing surface. Its height compensates for the step formed by the driver integrated circuit, eliminating gaps where resin could leak through. This ensures both static electricity prevention and prevents contamination from resin leakage.
Solution Approach 2:
The sealing member is disposed beforehand to compensate for the step formation, creating a predetermined sealing structure that prevents resin leakage before the encapsulation resin is applied. This prior cushioning approach eliminates the risk of contamination during the encapsulation process.
3Reliability
If a sealing member is added to compensate for the step, then tape adhesion and sealing are improved, but device structure complexity increases
Solution Approach 1:
The sealing member performs multiple functions simultaneously: it compensates for the step formed by the driver integrated circuit, provides a sealing barrier to prevent resin leakage, and creates a flat surface for insulating tape adhesion. By consolidating these functions into a single component, the increase in structural complexity is minimized while achieving multiple reliability improvements.
4Reliability
If the sealing member height is increased to fully cover the driver integrated circuit, then sealing is improved, but the insulating tape cannot be properly attached
Solution Approach 1:
The sealing member is designed with localized height distribution - its height is sufficient to compensate for the step formed by the driver integrated circuit and provide sealing, but not excessively high. This localized quality optimization ensures that the upper surface remains accessible for insulating tape attachment while maintaining adequate sealing performance.
Data Source
AI summary
A display device and a method for fabricating the same are provided. The display device includes a display panel, a first circuit board which has a first end attached onto the display panel, a driver integrated circuit which is disposed on the first circuit board, a sealing member disposed on the first circuit board and which surrounds an outer surface of the driver integrated circuit, and an insulating tape which is disposed on the sealing member and the driver integrated circuit.