Display Device Sealing Member Stress Buffer
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Solution Overview
Problem
Display devices face challenges in preventing damage to sealing members and display panel pad units, particularly due to moisture ingress and mechanical stress during the bonding process, which can lead to corrosion and delamination issues.
Innovation Solution
The design incorporates a display device with a specific configuration of connection circuit boards and a sealing member, where the second connection circuit board is positioned above the first, with adjusted thicknesses and positions of pads and output pads to minimize mechanical stress and moisture exposure, and a sealing member that covers the edges of both circuit boards to prevent moisture ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a sealing member is used to seal the gap between the circuit board and the display panel, then moisture ingress is prevented, but the sealing member may be damaged due to mechanical stress during the bonding process
Solution Approach 1:
The patent introduces a buffer layer between the anisotropic conductive film and the sealing member that absorbs and distributes mechanical stress during the bonding process. This buffer layer acts as a cushioning element that prevents direct transmission of stress to the sealing member, thereby protecting it from damage while maintaining its moisture sealing function.
Solution Approach 2:
The buffer layer serves as an intermediary element between the bonding process (source of mechanical stress) and the sealing member. It mediates the interaction by absorbing excess stress and preventing it from reaching the sealing member, thus resolving the contradiction between achieving proper bonding and protecting the sealing member.
2Reliability
If the circuit board is bonded to the display panel using anisotropic conductive film, then electrical connection is achieved, but mechanical stress during bonding may damage the sealing member and pad units
Solution Approach 1:
The buffer layer is positioned between the anisotropic conductive film and the sealing member to provide beforehand cushioning against mechanical stress. This allows the bonding process to proceed effectively for electrical connection while the buffer layer预先 absorbs and distributes the mechanical stress, preventing damage to the sealing member and pad units.
3Area of stationary object
If the pads are positioned closer to the edge of the display panel, then the bezel area is reduced, but the pad units become more susceptible to damage from moisture and mechanical stress
Solution Approach 1:
The buffer layer extends to provide beforehand cushioning protection to the pad units that are positioned closer to the edge. This allows the design to achieve reduced bezel area while the buffer layer protects the exposed pad units from mechanical stress and moisture ingress during and after the bonding process.
Solution Approach 2:
The buffer layer functions as a protective thin film that covers and protects the pad units. This flexible protective layer allows the pads to be positioned at the edge for minimal bezel area while providing a protective barrier against environmental factors and mechanical stress.
Data Source
AI summary
A display device includes a display panel, a first connection circuit board, a second connection circuit board, and a sealing member. The display panel may include an insulation layer, a first pad, and a second pad. A distance between a top surface of the insulation layer and a bottom surface of the second connection circuit board may be substantially the same as that between the top surface of the insulation layer and a top surface of the first connection circuit board.