Display Device Shield Plate With Recessed IC Contact for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face challenges in improving image quality, luminance, light uniformity, and controlling light purity, particularly from backlight units, while effectively dissipating heat generated by control boards.
Innovation Solution
A display device design incorporating a frame, a first board with an IC chip, and a shield plate with a recessed portion that contacts the IC chip, enhancing light control and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield plate is positioned close to the first board for shielding, then electromagnetic interference protection is improved, but heat dissipation deteriorates
Solution Approach 1:
The recessed portion is formed by nesting a cavity within the shield plate structure itself. The recessed portion penetrates through the shield plate to contact the IC chip, creating a nested configuration where the cooling channel is embedded within the shielding structure. This resolves the contradiction by integrating both shielding and heat dissipation functions into a single nested component rather than requiring separate structures.
Solution Approach 2:
The invention transitions from a two-dimensional flat shield plate to a three-dimensional structure with a penetrating recessed portion. By adding the vertical dimension through the recessed portion that contacts the IC chip, the shield plate gains heat dissipation capability while maintaining its electromagnetic shielding function. This dimensional change allows simultaneous achievement of both shielding proximity and effective heat dissipation.
2Temperature
If the shield plate is spaced apart from the first board, then heat dissipation is improved, but electromagnetic shielding effectiveness deteriorates
Solution Approach 1:
The recessed portion is nested within the shield plate structure, creating an integrated solution where the shielding function and heat dissipation function coexist in the same component. The recessed portion penetrates the shield plate to directly contact the IC chip, ensuring close thermal contact while the shield plate maintains its electromagnetic shielding capability through its inherent structure.
Solution Approach 2:
The shield plate is designed to perform multiple functions simultaneously: electromagnetic shielding and heat dissipation. By incorporating the recessed portion that contacts the IC chip, the shield plate becomes a multi-functional component that addresses both electromagnetic interference protection and thermal management, eliminating the need for separate shielding and cooling structures.
3Temperature
If a recessed portion is added to the shield plate for heat dissipation, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The invention merges the shielding function and heat dissipation function into a single integrated shield plate structure. The recessed portion is formed as an integral part of the shield plate rather than as a separate component. This merging approach reduces overall device complexity by eliminating the need for separate shielding plates and heat dissipation structures, while still achieving effective heat dissipation through the recessed portion that contacts the IC chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves image quality, luminance, and light uniformity, reduces bluish phenomena, and effectively dissipates heat, resulting in enhanced display performance.
Implementation Method 1
a recessed portion which protrudes toward the first board, and which is in contact with the IC chip
Data Source
AI summary
Disclosed is a display device. The display device according to an aspect of the present disclosure may include: a display panel; a frame which is located in a rearward direction of the display panel, and to which the display panel is coupled; a first board including an IC chip and coupled to a rear of the frame; and a shield plate spaced apart from the first board, covering the first board, and coupled to the frame, wherein the shield plate comprises a recessed portion which protrudes toward the first board and which is in contact with the IC chip.