Display Device Shielding Layer for Heat Dissipation and Impact Buffering
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Solution Overview
Problem
Existing display devices face challenges in effectively dissipating heat generated by driving chips and protecting the display panel from external impacts while maintaining structural integrity and reducing electromagnetic interference.
Innovation Solution
Incorporating a substrate with defined openings, a shielding layer along the substrate's lower surface, and a first organic layer that fills these openings, which enhances heat dissipation and provides buffering properties, while a second organic layer complements the substrate's rigidity in the pad area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipating member is disposed on the back surface of the display panel, then heat dissipation is improved, but the structure becomes more complex
Solution Approach 1:
The shielding layer is designed to perform both electromagnetic shielding and heat dissipation functions simultaneously. By merging these two functions into a single layer structure, the patent avoids adding separate heat dissipation components, thus improving heat dissipation without significantly increasing structural complexity
Solution Approach 2:
The shielding layer is designed with multi-functionality, serving as both an electromagnetic interference shield and a heat dissipation pathway. This universal design allows the same structure to address multiple technical requirements, reducing the need for additional specialized components
2Strength
If a buffer member is disposed on the back surface of the display panel, then protection from external impact is improved, but the structure becomes more complex
Solution Approach 1:
The organic layer is designed to provide both mechanical buffering protection and electromagnetic shielding support. By combining the buffering function with the shielding layer structure, the patent achieves protection from external impacts without adding separate buffer members, thus reducing structural complexity
3Temperature
If the shielding layer continuously extends within the openings, then heat dissipation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The substrate is designed with openings (porous structure) that allow the shielding layer to continuously extend through them. This porous design provides heat dissipation pathways while the openings themselves serve as guides for precise alignment during manufacturing, actually reducing the difficulty of achieving precise opening alignment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat, shields against electromagnetic interference, and protects the display device from external impacts, improving its structural integrity and visibility.
Implementation Method 1
a heat dissipating member which dissipates the heat generated by the driving chip may be disposed on a back surface of the display panel
Implementation Method 2
a first organic layer disposed under the shielding layer and flattening a lower surface of the shielding layer
Data Source
AI summary
A display device includes: a substrate including a display area and a bending area positioned on one side of the display area, a lower surface of the substrate defining a plurality of openings; a shielding layer disposed along a profile of the lower surface of the substrate and continuously extending within the plurality of openings; and a first organic layer disposed under the shielding layer and flattening a lower surface of the shielding layer.