Display Device Side Surface Bonding Bezel Reduction
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Solution Overview
Problem
Conventional methods for bonding a driving chip or flexible printed circuit board to a display panel result in an increased bezel area, which is undesirable for display devices.
Innovation Solution
The display device incorporates a conductive connection pad on its side surface, allowing for the external driving device to be bonded directly to the side surface of the display panel, thereby reducing the bezel area. Additionally, a filling member made of inorganic material is used to protect the side terminal and prevent outgassing during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the driver is bonded to the upper surface of the display panel, then the bonding is straightforward, but the bezel area increases
Solution Approach 1:
The patent moves the bonding location from the upper surface (2D plane) to the side surface (3D dimension) of the display panel. By forming the conductive connection pad on the side surface and bonding the flexible printed circuit board to this side surface, the invention utilizes the vertical dimension to reduce the horizontal footprint, thereby decreasing the bezel area while maintaining bonding functionality.
2Reliability
If a filling member is used to protect the side terminal, then protection is provided, but outgassing may occur during bonding
Solution Approach 1:
The patent changes the material parameter of the filling member from organic material to inorganic material. This parameter change eliminates the outgassing issue that occurs with organic materials during the bonding process, while still providing the necessary protection for the side terminal. The inorganic filling member maintains protective functionality without generating harmful gases.
Data Source
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AI summary
A display device includes: a first layer including a pixel array disposed on a base substrate, a side terminal disposed on the base substrate, and a transfer wiring electrically connected to the side terminal and the pixel array; a second layer coupled with the first layer; a seal disposed between the first layer and the second layer and surrounding the pixel array; a filler, spaced apart from the seal, overlapping at least a portion of the side terminal and filling a space between the first layer and the second layer; and a conductive connection pad disposed on a side surface of the first layer and contacting the side terminal.