Display Side-Surface Connection Line Hardening With Electromagnetic Waves
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Solution Overview
Problem
The existing methods for forming side surface connection lines in display devices are time-consuming due to the limitations of laser hardening, which requires a narrow heating area and thus prolongs the process.
Innovation Solution
A method involving an electromagnetic wave output device that irradiates a wavelength of 1 mm to 1 m onto the conductive material on the side surface of a substrate to form a side surface connection line, using materials like silver, molybdenum, or copper, and moving electromagnetic wave output units to induce current and harden the material efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser hardening is used to form side surface connection lines, then the conductive material can be hardened, but the process time is prolonged due to narrow heating area
Solution Approach 1:
The patent replaces the mechanical laser hardening system with an electromagnetic wave output device that generates electromagnetic waves (microwave range) to heat and harden the conductive material. This substitution allows for wider area heating compared to the narrow focal area of laser, thereby reducing process time while maintaining hardening effectiveness
Solution Approach 2:
The patent changes the heating parameter from laser (narrow, high-intensity focal heating) to electromagnetic waves (wider area heating with wavelength 1 mm to 1 m). This parameter change enables simultaneous heating of a broader area of the conductive material on the side surface, reducing the overall process time required to form the side surface connection line
2Productivity
If electromagnetic wave irradiation is used to heat conductive material, then heating area is expanded and process time is shortened, but energy consumption increases
Solution Approach 1:
The electromagnetic wave output device is configured to irradiate electromagnetic waves selectively onto the side surface area where the conductive material is located. By concentrating the electromagnetic energy on the specific region requiring hardening rather than heating the entire substrate, energy consumption is minimized while still achieving the productivity improvement through expanded heating area
Solution Approach 2:
The electromagnetic wave output device operates by emitting electromagnetic waves in a controlled periodic manner, allowing the conductive material to absorb energy efficiently and reach the required temperature for hardening. This periodic emission pattern optimizes energy utilization by preventing excessive energy input while maintaining the expanded heating area benefit
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly shortens the time required to form the side surface connection line by effectively heating and hardening the conductive material across a wider area, improving the manufacturing efficiency of display devices.
Implementation Method 1
An induced current may be formed in the third direction by the electromagnetic wave in the side surface connection line
Implementation Method 2
forming a side surface connection line by an electromagnetic wave output device irradiating an electromagnetic wave having a wavelength onto the conductive material on the side surface of the substrate
Data Source
AI summary
A method of manufacturing a display device includes forming a pad part on an upper surface of a substrate, forming a lower electrode on a lower surface of the substrate, connecting the lower electrode and a flexible circuit board to each other, disposing, on a side surface of the substrate, a conductive material for electrically connecting the pad part and the lower electrode to each other, and forming a side surface connection line by an electromagnetic wave output device irradiating an electromagnetic wave having a wavelength onto the conductive material on the side surface of the substrate. In the display device and the manufacturing method thereof in accordance with the disclosure, a time necessary to form a side surface connection line is shortened.