LED Display Panel Side-Line Layout for Zero-Bezel Tiling
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Solution Overview
Problem
Liquid crystal display devices (LCDs) and organic light emitting display devices (OLEDs) face challenges in reducing bezel size and implementing ultra-large screens without visible bezels, as well as high heat generation due to line resistance issues.
Innovation Solution
A display device design featuring a substrate with light emitting diodes, upper and lower lines on the top and rear surfaces, and side lines connected by a shorting bar on the side surface, which reduces line resistance and allows for zero-bezel implementation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a plurality of display panels are disposed in the form of tiles to implement ultra-large screen, then the screen size is increased, but visible bezel areas appear between adjacent panels
Solution Approach 1:
The patent moves the power supply lines from the traditional planar arrangement (on the front or back surface of the substrate) to a three-dimensional arrangement by routing them along the side surface of the substrate. This dimensional change allows the power supply lines to be positioned outside the active display area, enabling adjacent panels to be placed flush against each other without visible bezels, while still providing adequate space for electrical connections.
2Device complexity
If power supply lines are arranged on the front or back surface of the substrate, then the structure is simple, but line resistance increases and heat generation worsens
Solution Approach 1:
The patent relocates the power supply lines from the two-dimensional plane (front or back surface) to the vertical dimension by routing them along the side surface of the substrate. This allows for longer, more optimized current paths that reduce resistance and heat generation, while the side-surface positioning maintains structural simplicity by utilizing the substrate's lateral space rather than complicating the planar layout.
3Ease of manufacture
If power supply lines are arranged on the front or back surface of the substrate, then the manufacturing process is simple, but line resistance increases
Solution Approach 1:
The patent implements a three-dimensional routing approach where power supply lines are formed along the side surface of the substrate using standard thin-film deposition techniques. This dimensional transition allows for optimized current paths that reduce resistance, while the manufacturing process remains compatible with existing semiconductor fabrication methods, maintaining ease of manufacture through established工艺流程.
Data Source
AI summary
A display apparatus can include a substrate on which a plurality of light emitting diodes is disposed. The display apparatus further includes a plurality of first upper lines disposed on a top surface of the substrate. The display apparatus further includes a plurality of first lower lines disposed on a rear surface of the substrate. The display apparatus further includes a plurality of first side lines disposed on a side surface of the substrate and electrically connected to the plurality of first upper lines and the plurality of first lower lines. The display apparatus further includes a first shorting bar disposed on the side surface of the substrate and electrically connecting at least some of the plurality of first side lines.