Display Device Side Face Pad Bonding Reduces Bezel Area
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Display devices have a large bezel area and stepped portions due to exposed signal pads for electrical connections, limiting aesthetic appeal and implementation of various designs.
Innovation Solution
A display device structure where the first and second substrates face each other with matching ends, featuring connection electrodes on side faces of pads, an insulating layer with spread prevention holes, and auxiliary electrodes for improved electrical connections, allowing the flexible printed circuit film to be bonded to the side faces rather than the top faces, reducing the bezel area and preventing stepped portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signal pads are exposed on the top face of the lower substrate for electrical connection, then electrical connection to the flexible printed circuit film is achieved, but the bezel area increases and stepped portions are created
Solution Approach 1:
The patent moves the electrical connection interface from the top face (2D plane) to the side face (vertical dimension) of the lower substrate. The flexible printed circuit film is bonded to the side face of the lower substrate, and signal pads are formed on the side face, enabling electrical connection without exposing pads on the top face, thus reducing bezel area while maintaining connection reliability
Solution Approach 2:
Instead of the conventional approach where the flexible printed circuit film is bonded to the top face of the lower substrate, the patent inverts the bonding location to the side face. This inversion eliminates the need for a large bezel area to accommodate exposed signal pads while maintaining effective electrical connection between the film and the substrate
2Reliability
If signal pads are exposed on the top face of the lower substrate, then electrical connection is enabled, but stepped portions are created in the bezel area
Solution Approach 1:
By relocating the signal pads and bonding interface to the side face of the lower substrate, the patent eliminates the stepped portions that would otherwise form in the bezel area. The connection structure is moved to a different spatial dimension, allowing the top face to remain flush and enabling various aesthetic designs without structural interruptions
3Reliability
If the lower substrate extends beyond the upper substrate to expose signal pads, then electrical connection is achieved, but the overall device size increases
Solution Approach 1:
The patent relocates the electrical connection interface from the horizontal plane (requiring substrate extension) to the vertical side face. This dimensional change allows the substrates to align at their edges without requiring the lower substrate to extend beyond the upper substrate, maintaining compact device dimensions while ensuring reliable electrical connection
Data Source
AI summary
A display panel according to various embodiments comprises: a first substrate and a second substrate facing each other; a first pad and a second pad between the first substrate and the second substrate at an end of the first substrate; a first connection electrode on a side face of the first pad and a second connection electrode on a side face of the second pad; an insulating layer disposed on a top face of the first substrate and disposed on at least a portion of a top face of the first and second pads; and at least one spread prevention hole in the insulating layer between the first and second pads.