Display Device Inclined Side Surface Terminal
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Solution Overview
Problem
Conventional display devices face challenges in reducing bezel size and thickness due to the bonding of driving chips or flexible printed circuit boards, which increase the peripheral area and thickness, and are prone to damage from bending stress.
Innovation Solution
A display device with an inclined side surface and a conductive connection pad that extends continuously on both the side and lower surfaces, allowing for a rigid circuit board to be used instead of a flexible printed circuit board, and enabling the external driving device to be bonded without bending, thus reducing the bezel size and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a flexible printed circuit board is used to bond the driving chip to the side surface of the display panel, then the bezel size is reduced, but the thickness increases due to the bending portion
Solution Approach 1:
The patent transitions from bonding the driving chip on the upper surface (2D plane) to bonding on the side surface (3D spatial repositioning). The side terminal extends along the inclined side surface, allowing electrical connection in a different spatial dimension, thereby reducing bezel size without requiring thickness increase for bending portions.
Solution Approach 2:
The conductive connection pad is divided into multiple portions: a first portion on the inclined side surface contacting the side terminal, and a second portion on the lower surface. This segmentation allows the connection path to follow the inclined geometry, eliminating the need for a thick bending portion while maintaining electrical connectivity.
2Area of stationary object
If a flexible printed circuit board is used to accommodate the side surface bonding, then the bezel size is reduced, but the reliability decreases due to bending stress
Solution Approach 1:
The patent replaces the flexible printed circuit board (which is prone to bending damage) with a rigid circuit board structure. The conductive connection pad is formed as an integral part of the rigid substrate, eliminating the flexible component that is susceptible to stress and failure from bending.
3Ease of manufacture
If the driving chip is bonded to the upper surface of the display panel substrate, then the electrical connection is straightforward, but the bezel size increases
Solution Approach 1:
The patent moves the bonding location from the upper surface (conventional 2D bonding) to the side surface (3D spatial repositioning). The side terminal extends along the inclined side surface to provide electrical connection, achieving compact bezel size while maintaining manufacturing feasibility through the inclined geometry design.
4Area of stationary object
If an inclined side surface is formed to accommodate the side terminal, then the bezel size and thickness are reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent introduces an inclined side surface with a specific slope angle, creating an asymmetric geometry that accommodates the side terminal and conductive connection pad. This asymmetric design enables compact bezel size while the inclination angle is optimized to balance manufacturing complexity with space reduction benefits.
Data Source
AI summary
A display device includes an array substrate including a pixel array disposed on a base substrate, a side terminal disposed on the base substrate, and a transfer wiring electrically connected to the side terminal and the pixel array, the array substrate having an inclined side surface, and a conductive connection pad including a first portion disposed on the inclined side surface of the array substrate to contact the side terminal and a second portion disposed on a lower surface of the array substrate. The first portion and the second portion are connected to each other.