Display Panel Side-Wire Layout for Seamless Panel Splicing
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Solution Overview
Problem
The splicing of multiple display panels results in seams due to the thickness of the flexible circuit board, leading to discontinuous displayed images.
Innovation Solution
A display panel design with reduced border frames and a chip-on-film package structure that includes a side wire with sequentially connected bonding portions, allowing for improved bonding and repair processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible circuit board is used to connect display panels, then electrical connection is achieved, but the thickness of the border frame increases causing seams in spliced displays
Solution Approach 1:
The side wire extends in multiple dimensions: from the first surface through the side surface to the second surface of the circuit substrate. This three-dimensional routing allows the wire to connect bonding portions on opposite surfaces without requiring thick border frames, effectively moving the connection path into the depth dimension of the substrate.
Solution Approach 2:
The side wire is divided into multiple segments: a first bonding portion on the first surface, a second bonding portion on the second surface, and extension portions connecting them through the side surface. This segmentation allows each portion to be optimized for its specific function while maintaining overall connectivity without increasing border frame thickness.
2Area of stationary object
If the border frame thickness is reduced, then screen ratio is improved, but the process margin for bonding the chip-on-film package structure decreases
Solution Approach 1:
The chip-on-film package structure is bonded to the second bonding portion on the second surface of the circuit substrate, utilizing the z-dimension (depth) to provide bonding space. This allows the bonding process to occur within the thickness of the substrate rather than requiring additional lateral space in the border frame region.
Solution Approach 2:
The side wire is pre-formed with extension portions that protrude from the side surface before the chip-on-film package structure is bonded. This preliminary preparation of the bonding interface provides adequate process margin for subsequent bonding operations without requiring thicker border frames.
3Area of stationary object
If multiple display panels are spliced together, then large format display is achieved, but seams are formed due to border frame thickness causing discontinuous images
Solution Approach 1:
The flexible circuit board is extracted from the border frame region and replaced with thin side wires that route through the substrate thickness. This removes the primary source of seam formation (thick flexible circuit boards) while maintaining electrical connectivity between spliced panels.
Solution Approach 2:
The side wire structure uses thin-film conductive materials to create low-profile connection paths through the substrate. These thin film structures minimize the thickness contribution to border frames, enabling seamless splicing of multiple display panels to form large format displays.
Data Source
AI summary
A display panel includes a circuit substrate, light emitting elements, a side wire, and a chip-on-film package structure. The circuit substrate includes a circuit structure located on a first surface. The side wire includes a first bonding portion disposed on the first surface of the circuit substrate and bonded to the circuit structure, a first extension portion, a second extension portion, and a second bonding portion that are sequentially connected and have the same resistivity. The first extension portion is disposed on a side surface of the circuit substrate. The second extension portion is disposed on a second surface of the circuit substrate and overlapped with a peripheral region. The second bonding portion is disposed on the second surface of the circuit substrate. An orthogonal projection of the second bonding portion is overlapped with a display region. The chip-on-film package structure is bonded to the second bonding portion.