Display Side Wiring Structure for Bezel Reduction and Connection Reliability
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Solution Overview
Problem
Current display devices face challenges in maximizing display area due to the presence of bezel areas, which can be minimized by improving side wiring formation technology to reduce or eliminate the bezel, thereby enhancing device reliability and efficiency.
Innovation Solution
A display device design featuring a substrate with side wiring that connects pads on opposite surfaces, using silver (Ag) and an overcoat layer, and a chamfered surface configuration to secure connections and prevent chipping, allowing for a bezel-less structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wiring formation technology is used, then the bezel area can be formed to protect internal structures, but the display area is reduced and device reliability is compromised
Solution Approach 1:
The patent transitions from planar wiring formation to three-dimensional side wiring formation on the substrate edge. The side wiring is formed on the first side surface of the substrate, extending from the first surface to the second surface, enabling electrical connections without occupying display area on the front or back surfaces.
Solution Approach 2:
The wiring structure is segmented into multiple components: side wiring on the substrate edge, first pad on the first surface, second pad on the second surface, and overcoat layers. This segmentation allows each component to perform its function optimally while reducing overall bezel requirements.
2Area of stationary object
If side wiring formation technology is used to eliminate bezel, then display area is maximized, but connection security and chipping prevention become challenging
Solution Approach 1:
The patent uses composite material structures including overcoat layers covering the side wiring, with the overcoat providing both mechanical protection against chipping and electrical insulation. The side wiring itself may comprise multiple material layers for optimal conductivity and adhesion.
Solution Approach 2:
The overcoat layer is applied beforehand to protect the side wiring from mechanical damage and environmental factors. This protective layer prevents chipping at the substrate edge and secures the wiring connections before the device is put into service.
3Reliability
If multiple contact portions are used to connect pads to side wiring, then electrical connection reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The first pad serves multiple functions: it provides electrical connection to the light emitting element, connects to multiple side wirings through contact portions, and may include inspection portions for quality control. This multi-functionality reduces the need for separate dedicated structures.
Solution Approach 2:
The pad structure includes inspection portions that enable self-verification of connection quality. The first inspection portion and second inspection portion allow for detecting contact holes and verifying electrical connections without requiring external testing equipment during manufacturing.
Data Source
AI summary
A display device includes a substrate having a first surface on which a light emitting element is located, a second surface on which a driving unit for driving the light emitting element is located, the second surface being opposite the first surface, and a first side surface between the first surface and the second surface, a first pad on the first surface of the substrate and electrically connected to the light emitting element, a second pad on the second surface of the substrate and electrically connected to the driving unit, and a side wiring on the first surface, the second surface, and the first side surface of the substrate to electrically connect the first pad and the second pad. The side wiring includes a first side wiring and a second side wiring spaced from each other.