Display Substrate Signal Interconnection Layout for Uniform Transmission
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Solution Overview
Problem
Large-size display products face challenges in achieving uniformity of signal transmission due to variations in signal transmission layers, which affect display quality and stability.
Innovation Solution
A display substrate design featuring multiple laminated signal interconnection layers, including a first and second signal interconnection layer, with a first contact region between the signal transmission layer and the first interconnection layer, and an interconnection region formed between these layers, ensuring partial overlap on the base substrate, allowing for multi-layered signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single signal interconnection layer is used, then the device complexity is low, but the signal uniformity deteriorates
Solution Approach 1:
The patent transitions from a single-plane signal transmission structure to a multi-layer stacked structure. The first and second signal interconnection layers are arranged at different positions in the thickness direction, creating a three-dimensional signal transmission path. This dimensional change allows signals to be transmitted through multiple parallel paths, improving uniformity while distributing the complexity across layers rather than increasing it within a single layer.
Solution Approach 2:
The signal interconnection function is segmented into multiple independent layers. The first signal interconnection layer and second signal interconnection layer are separated in the thickness direction, with each layer providing distinct signal transmission paths. This segmentation allows independent optimization of each layer and improves overall signal uniformity by distributing transmission loads across multiple segments.
2Area of stationary object
If the signal transmission layer area is increased for large-size displays, then the display size is improved, but the signal uniformity deteriorates
Solution Approach 1:
For large-size displays requiring extensive signal transmission areas, the patent introduces a vertical dimension by stacking signal interconnection layers. Instead of relying solely on lateral expansion of a single layer, the multi-layer structure provides additional transmission paths in the thickness direction, maintaining signal uniformity across large display areas by distributing signals across multiple vertical layers.
3Reliability
If multiple signal interconnection layers are added, then the signal uniformity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent introduces an insulation layer as an intermediary between the first and second signal interconnection layers. This insulation layer provides a stable reference plane and isolation medium, facilitating precise alignment and positioning of the signal layers during manufacturing. The intermediary structure simplifies the manufacturing process by providing clear boundaries and reference points for layer registration.
4Reliability
If the signal interconnection layers are made thicker to improve signal transmission, then the signal stability is improved, but the device complexity increases
Solution Approach 1:
Instead of increasing the thickness of a single signal interconnection layer, the patent achieves enhanced signal stability by adding layers in the vertical dimension. The first and second signal interconnection layers are stacked at different positions in the thickness direction, providing multiple parallel transmission paths that improve signal stability without requiring individual layers to be excessively thick, thereby avoiding excessive device complexity.
Data Source
AI summary
A display substrate includes a signal transmission layer, at least two signal interconnection layers laminated one on another, and a first signal end. The signal interconnection layers include a first signal interconnection layer coupled to the signal transmission layer and a second signal interconnection layer coupled to the first signal end; a first contact region is provided between the signal transmission layer and the first signal interconnection layer; the first signal interconnection layer includes a first portion, the second signal interconnection layer includes a second portion, an interconnection region is formed between the second portion and the first portion, and the first portion is coupled to the second portion at the interconnection region; and an orthographic projection of the interconnection region onto the base substrate at least partially overlaps with an orthographic projection of the first contact region onto the base substrate.