Under-Panel Display Signal Layout for Higher Light Transmittance

The patent applies multi-layer stacking of signal lines (first, second, and third signal lines on different layers) to achieve three-dimensional routing. This allows signal lines to be arranged in vertical and diagonal directions rather than only horizontal/vertical planes, enabling connections to electronic modules while passing through transparent regions above and below the display panel, thus maintaining light transmission in the display area.

The signal lines are divided into multiple segments (first signal line, second signal line, third signal line) that are spatially separated and connected through connection parts. This segmentation allows each segment to be optimized for different functions: some segments can be positioned in transparent regions for light transmission, while others provide necessary electrical connectivity to electronic modules.

The patent uses multi-layer stacking to arrange signal lines in three-dimensional space rather than only on a single plane. By distributing signal lines across multiple layers and using connection parts to link them, the design achieves minimal overlap and optimal light transmission paths while maintaining a systematic and manufacturable structure.

The signal lines are nested within each other in a hierarchical manner, with connection parts serving as intermediate structures that link different signal line levels. This nested arrangement allows compact integration of multiple signal paths without requiring excessive space or creating complex overlapping patterns on any single layer.