Mo-Nb Alloy and Copper Signal Lines for Display Devices
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Solution Overview
Problem
Existing signal lines in display devices face challenges with high line resistance and reliability issues due to materials with low resistivity, which lead to signal delays and poor durability, especially when scaled for larger displays.
Innovation Solution
A signal line structure comprising a first conductive layer of molybdenum-niobium alloy, a second conductive layer of copper-containing metal, and an optional third conductive layer of Mo-Nb alloy, along with a specific etchant composition of benzotriazole, citric acid, hydrogen peroxide, hydrofluoric acid, and deionized water for wet etching, is used to form low-resistance and reliable gate and data lines in thin film transistor arrays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If materials with low resistivity are used for signal lines, then line resistance is reduced, but physical and chemical characteristics deteriorate leading to poor durability and corrosion
Solution Approach 1:
The patent employs a composite structure consisting of a first conductive layer (low resistivity material such as copper or copper alloy) and a second conductive layer (protective material such as molybdenum, tungsten, or their alloys). This composite structure combines the low resistivity of the first layer with the superior physical and chemical characteristics of the second layer, thereby reducing line resistance while maintaining durability and resistance to corrosion.
2Reliability
If materials with low resistivity are used for signal lines, then line resistance is reduced, but contact with other materials is easily corroded
Solution Approach 1:
The patent employs a composite structure consisting of a first conductive layer (low resistivity material such as copper or copper alloy) and a second conductive layer (protective material such as molybdenum, tungsten, or their alloys). This composite structure combines the low resistivity of the first layer with the superior physical and chemical characteristics of the second layer, thereby reducing line resistance while maintaining durability and resistance to corrosion.
3Reliability
If manufacturing process uses materials with poor characteristics, then line resistance is reduced, but remnants and skews are greatly generated
Solution Approach 1:
The patent employs a composite structure consisting of a first conductive layer (low resistivity material such as copper or copper alloy) and a second conductive layer (protective material such as molybdenum, tungsten, or their alloys). This composite structure combines the low resistivity of the first layer with the superior physical and chemical characteristics of the second layer, thereby reducing line resistance while maintaining durability and resistance to corrosion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution significantly reduces line resistance and improves reliability by enhancing adhesion, preventing oxidation, and minimizing remnants and skews during the manufacturing process, thereby improving the overall performance and durability of signal lines in display devices.
Implementation Method 1
an etchant for use in the manufacture of a display device having the signal line
Data Source
AI summary
A thin film panel includes a substrate, a gate line formed on the substrate, a gate insulating layer formed on the gate line, a semiconductor layer formed on the gate insulating layer, a data line, including a source electrode, and a drain electrode formed on the gate insulating layer or the semiconductor layer, and a pixel electrode connected to the drain electrode, wherein at least one of the gate line and the data line and drain electrode includes a first conductive layer made of a molybdenum Mo-niobium Nb alloy and a second conductive layer made of a copper Cu-containing metal.