Display Module Signal Pad Integration with Insulation Openings
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Solution Overview
Problem
Existing display modules face challenges in efficiently integrating signal pads and signal lines with input sensors, particularly in preventing short circuits and ensuring reliable electrical connections.
Innovation Solution
The display module incorporates a display panel with a non-display region containing signal pads connected through signal lines, an input sensor with a sensing insulation layer and conductive layers, and residue conductive patterns spaced apart from the signal pads to prevent short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the sensing insulation layer overlaps the signal pads, then the input sensor can be integrated with the display panel, but short circuits may occur between the sensing conductive layer and signal pads
Solution Approach 1:
The patent extracts the problematic overlapping region by creating openings in the sensing insulation layer that expose the signal pads. This removes the insulation layer material from critical areas where short circuits could occur, allowing the sensing conductive layer to be positioned without direct contact with signal pads while maintaining sensor integration
Solution Approach 2:
The sensing insulation layer is segmented into multiple regions through openings, allowing different areas to serve different functions. The openings create distinct zones where signal pads are exposed for electrical connection while other areas maintain insulation for preventing short circuits
2Area of stationary object
If the sensing conductive layer is positioned close to signal pads for compact design, then device area is reduced, but short circuits may occur
Solution Approach 1:
The patent introduces the sensing insulation layer as an intermediary element between the sensing conductive layer and signal pads. This mediator provides electrical insulation while allowing the sensing layer to be positioned in close proximity to signal pads for compact design, preventing direct contact that would cause short circuits
Solution Approach 2:
The patent utilizes the vertical dimension by stacking the sensing insulation layer between the sensing conductive layer and signal pads. This layered approach allows horizontal proximity for compactness while maintaining vertical separation for electrical isolation
3Reliability
If openings are created in the sensing insulation layer to expose signal pads, then electrical connections are enabled, but the insulation layer structure becomes more complex
Solution Approach 1:
The openings in the sensing insulation layer are formed in advance during the manufacturing process, before final assembly. This preliminary action allows for precise positioning and integration with other layers, reducing overall manufacturing complexity despite the apparent structural complication
Data Source
AI summary
A display module includes a display panel having a display region in which pixels are disposed and a non-display region having a first pad region in which first signal pads, electrically connected to the pixels respectively through first signal lines, are disposed. An input sensor is disposed on the display panel and it includes a sensing insulation layer including an organic material, and a sensing conductive layer. Each of the first signal pads includes first conductive patterns stacked along a thickness direction of the display panel. At least one of the first conductive patterns includes a same material as that of the sensing conductive layer. A first opening overlapping the first pad region is defined in the sensing insulation layer. A first residue conductive pattern, including the same material as that of the sensing conductive layer, is disposed on a border of the first opening.