Display Device Signal Pad Segmentation for Bonding Reliability

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Solution Overview

Problem

Display devices face defects in signal pads due to high pressure from conductive balls during bonding, leading to potential breakage and reduced reliability.

Innovation Solution

A display device design featuring a conductive adhesive layer with conductive balls, where the separation distance between the uppermost conductive pattern and the connection terminal is minimized, and an intermediate conductive pattern connects the uppermost conductive pattern to the end portion, reducing pressure and preventing breakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive balls are used to electrically connect the display panel and electronic component, then electrical connectivity is achieved, but high pressure is applied to signal pads causing breakage and defects

Engineering Contradiction:
Improvebonding reliabilityVSAvoidsignal pad strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The signal pad is divided into multiple portions (first portion, second portion, third portion) arranged in a staggered configuration. This segmentation distributes the pressure from conductive balls across multiple smaller contact areas, preventing concentration of stress on a single pad and reducing breakage risk while maintaining electrical connectivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An intermediate conductive pattern is introduced between the end portion of the signal line and the uppermost conductive pattern. This intermediary structure provides an additional contact point for conductive balls, distributing the bonding pressure and reducing the load on individual signal pads while ensuring reliable electrical connection.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If the separation distance between uppermost conductive pattern and connection terminal is reduced, then pressure on signal pads is minimized, but manufacturing precision requirements increase

Engineering Contradiction:
Improvesignal pad strengthVSAvoidalignment precision
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The signal pad structure is segmented into multiple portions at different positions and heights. This segmentation allows the system to tolerate larger variations in individual pad positions while maintaining overall connectivity, as the staggered arrangement provides multiple potential contact points for conductive balls.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The signal pad portions are arranged in three-dimensional space with different heights (first height, second height, third height). This vertical dimensionality adds tolerance to horizontal alignment variations, allowing larger separation distances without compromising connection reliability, thereby reducing manufacturing precision requirements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If intermediate conductive pattern is added to connect uppermost conductive pattern and end portion, then pressure distribution is improved, but device complexity increases

Engineering Contradiction:
Improvebonding reliabilityVSAvoidpad structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The intermediate conductive pattern serves multiple functions: it acts as an additional electrical connection point, distributes bonding pressure, and provides mechanical support. By combining these functions into a single structure, the overall device complexity is minimized while achieving improved reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The intermediate conductive pattern is positioned to automatically receive conductive balls during the bonding process, utilizing the natural placement of conductive balls to establish connections. This self-aligning feature reduces the need for complex alignment mechanisms and simplifies the bonding process.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design minimizes pressure on the signal pads, reducing the likelihood of breakage and enhancing the reliability of the bonding process, thereby reducing defects in the display device.

Implementation Method 1

a conductive adhesive layer including an adhesive layer and a plurality of conductive balls in the adhesive layer

Methodology Applied
Scientific EffectAdhesive: Adhesive

Data Source

PatentUS20230329051A1Display device
Publication Date: 2023.10.12 SAMSUNG DISPLAY CO LTD
  • US20230329051A1 patent drawing
  • US20230329051A1 patent drawing
  • US20230329051A1 patent drawing

AI summary

A display device includes a display panel, an electronic component including a silicon transistor having a first gate and an oxide transistor having a second gate, and a conductive adhesive layer, wherein the display panel includes a base layer, a pixel, a signal line having an end portion on a same layer as the second gate, a signal pad, a lower insulation layer, and an upper insulation layer having a contact hole defined thereon, wherein the end portion is on the lower insulation layer, and includes a first portion exposed by the contact hole and a second portion covered by the upper insulation layer, and the signal pads includes an uppermost conductive pattern electrically connected to the end portion of the signal line, wherein the electronic component includes a connection terminal on the uppermost conductive pattern.