Display Substrate Step Structure for Narrow-Bezel Bonding
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Solution Overview
Problem
Display substrates with Pad Bending structures face issues such as film peeling, cracking, and limited ability to reduce the width of the lower bezel due to bending radius limitations.
Innovation Solution
A display substrate design featuring a bonding region with a step structure where signal connection lines are exposed through openings, allowing bonding without bending, reducing defects and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If Pad Bending structure is used to reduce lower bezel width, then the width of the lower bezel is reduced to about 3.0 mm, but the display substrate is prone to film peeling and cracking in the bending area
Solution Approach 1:
The patent transitions from a 2D planar bonding region to a 3D stepped structure by introducing multiple height levels (first step, second step, third step) in the bonding region. This dimensional change allows the bonding pins to be exposed at different heights, eliminating the need for bending while maintaining narrow bezel width.
Solution Approach 2:
The bonding region is segmented into multiple steps with different heights. The first step exposes bonding pins for external connection, while the second and third steps provide progressively higher bonding regions. This segmentation allows the bonding function to be distributed across different height levels rather than requiring a single bent plane.
2Length of stationary object
If Pad Bending structure is used to reduce lower bezel width, then the width of the lower bezel is reduced, but the yield of the display substrate is relatively low
Solution Approach 1:
By introducing vertical dimensionality through stepped structures, the patent eliminates the bending process entirely. The bonding region extends in the vertical direction with multiple steps, allowing all bonding operations to occur on a flat surface, thereby improving manufacturing yield.
Solution Approach 2:
The bonding pins are pre-exposed at the first step during the manufacturing process, and the stepped structure is formed in advance. This preliminary preparation of the bonding interface eliminates the need for subsequent bending operations, reducing defects and improving yield.
3Length of stationary object
If Pad Bending structure is used, then the bonding region is bent to the back of the display substrate, but due to the limitation of the bending radius, it is technically more difficult to reduce the width of the lower bezel further
Solution Approach 1:
The patent resolves the bending radius limitation by abandoning the bending approach entirely and using vertical stepped structures instead. The bonding region extends upward in the vertical dimension with multiple steps, allowing the bezel width to be reduced without being constrained by bending radius requirements.
Solution Approach 2:
Instead of bending the bonding region horizontally to the back, the patent inverts the approach by creating vertical steps that expose bonding pins upward. This inversion of the bonding geometry eliminates the need for horizontal bending and its associated radius constraints.
Data Source
AI summary
Disclosed are a display substrate, a preparation method therefor, and a display device. The display substrate includes a display region and a binding region on one side of the display region. The binding region includes a binding structure layer disposed on a base. The binding structure layer includes a composite insulating layer disposed on the base. The binding region further includes a step structure formed by the base and the composite insulating layer. Heights of steps in the step structure decrease sequentially in the direction away from the display region. In the step structure, the base forms a first step having the smallest height. The binding structure layer further includes a signal connection wire having at least a portion thereof disposed on the step structure and located on the first step. An opening exposing the signal connection wire is provided on the base at the first step.