Display Device Layout With Straight Top-Surface Traces
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Solution Overview
Problem
Existing display device designs face issues with complex trace distribution, increased length and impedance due to the use of Au wires and lead-frames, leading to enlarged volume and increased process complexity.
Innovation Solution
The display device features a microcontroller unit located on the top surface of a driving substrate, with straight traces connecting it to the driving integration circuit, omitting the need for a flexible printed circuit board and reducing trace length and impedance, while incorporating a double-layer flexible printed circuit board design to integrate passive elements and a low-power Bluetooth module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Au wires and lead-frames are used to connect the printed circuit board and driving integration circuit, then electrical connection is achieved, but trace length and impedance increase
Solution Approach 1:
The patent merges the driving integration circuit directly onto the display substrate, eliminating the need for separate Au wires and lead-frames to connect to a printed circuit board. This integration reduces trace length and impedance while maintaining reliable electrical connection.
2Reliability
If multiple structures are used for connection, then electrical connectivity is ensured, but device volume is enlarged
Solution Approach 1:
The patent combines multiple functional structures into a single integrated substrate. The driving integration circuit, display substrate, and connection traces are merged into one compact structure, eliminating the need for separate printed circuit boards, Au wires, and lead-frames, thereby reducing overall device volume.
Solution Approach 2:
The patent extracts and eliminates unnecessary intermediate connection structures (Au wires, lead-frames, separate printed circuit boards) from the traditional multi-component design, keeping only the essential integrated structures needed for electrical connectivity.
3Reliability
If complex trace distribution is used to connect components, then electrical paths are established, but manufacturing complexity increases
Solution Approach 1:
By integrating the driving circuit directly onto the display substrate, the patent simplifies the manufacturing process. The trace distribution becomes part of the substrate fabrication rather than requiring separate wire bonding and assembly steps, reducing manufacturing complexity while maintaining electrical path integrity.
Data Source
AI summary
A display device includes a driving substrate, a flexible printed circuit board, a microcontroller unit, a driving integration circuit, and a trace. The driving substrate includes a top surface and a bottom surface. The flexible printed circuit board is electrically connected with the driving substrate and is disposed on the top surface of the driving substrate. The microcontroller unit is disposed on the top surface of the driving substrate. The driver integration circuit is disposed on the top surface of the driving substrate. The trace connects the microcontroller unit and the driver integration circuit. The trace is straight and is located on the top surface of the driving substrate.