Display Substrate Adhesion Part Holes for IC Contact Reliability
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Solution Overview
Problem
The existing manufacturing process for display substrates results in a weak adhesion force between the protection layer and the organic layer, leading to contact defects between the source driving circuit and the pads, which reduces the driving reliability of the display device during panel drop tests.
Innovation Solution
A display substrate design featuring a base substrate with a display area and a peripheral area, including a pixel electrode, pad part, adhesion part with holes, and a conductive adhesion member that makes electrical contact with the pad part and the terminal of an integrated circuit, enhancing the adhesion force between the pad and the IC, and using a multilayer structure with different thicknesses of the organic layer to improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a relatively thick organic layer is formed over the gate driving circuit to prevent corrosion, then the protection capability is improved, but the adhesion force between the organic layer and the protection layer becomes weak
Solution Approach 1:
The invention divides the protective structure into multiple functional layers: the organic layer for corrosion protection and a separate protection layer for mechanical strength. The adhesion layer is introduced at the interface to ensure strong bonding between these segmented layers, resolving the contradiction between protection capability and adhesion force.
Solution Approach 2:
An adhesion layer is introduced as an intermediary between the organic layer and the protection layer. This adhesion layer specifically enhances the bonding strength at the interface while allowing the organic layer to maintain its corrosion protection function and the protection layer to provide mechanical strength.
2Reliability
If the protection layer is removed during panel drop test due to weak adhesion, then the source driving circuit is damaged, but adding a thicker organic layer does not solve the adhesion problem
Solution Approach 1:
The adhesion layer serves as a mediator between the organic layer and protection layer, specifically addressing the adhesion failure issue during panel drop tests. It ensures that the protection layer remains firmly attached to the organic layer even under mechanical stress, preventing source driving circuit damage.
Solution Approach 2:
The invention creates a composite structure consisting of the organic layer, adhesion layer, and protection layer. Each layer contributes its specific properties: corrosion resistance from the organic layer, strong bonding from the adhesion layer, and mechanical protection from the protection layer, collectively improving driving reliability.
3Reliability
If individual pads are electrically connected through contact holes in the organic layer, then electrical connection is achieved, but contact defects form when the protection layer is removed
Solution Approach 1:
The contact holes are formed through the organic layer and adhesion layer before the protection layer is applied. This preliminary action ensures that the electrical connection path is established and protected from the outset, preventing contact defects that would otherwise occur when the protection layer is removed.
Solution Approach 2:
The adhesion layer acts as an intermediary that extends the contact holes structure, providing a stable electrical connection path that is protected by the overlying protection layer. This ensures that even when the protection layer is removed during panel drop tests, the electrical connection through the contact holes remains intact.
Data Source
AI summary
A display substrate includes a base substrate having a display area and a peripheral area which surrounds the display area, a pixel electrode formed on the display area, a pad part formed on the peripheral area, an adhesion part formed on the peripheral area and having a plurality of holes formed in an area adjacent to the pad part on the peripheral area and a conductive adhesion member formed on the pad part and the adhesion part to make electrical contact with the pad part and a terminal of an integrated circuit.