Display Substrate Aperture Organic-Inorganic Layering
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Solution Overview
Problem
The cutting process for forming apertures in display substrates often results in cracking due to the thickness of inorganic film layers, leading to poor product quality and issues like film peeling and dark spots.
Innovation Solution
A display substrate with organic material film layers and inorganic material film layers, where the inner side wall of the functional hole in the inorganic material film layers is coated with organic material, reducing the thickness of inorganic film layers to be cut and minimizing cracking during the aperture formation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the aperture area is cut through the inorganic film layers to form a functional hole, then the functional hole is formed successfully, but the inorganic film layers crack due to their thickness
Solution Approach 1:
The patent divides the film layer structure into organic and inorganic segments, with the organic film layer positioned to be cut while the inorganic film layer is protected. This segmentation allows different material types to be treated differently during the cutting process, preventing cracks in the inorganic layer while still forming the functional hole.
Solution Approach 2:
The organic film layer acts as an intermediary that absorbs the cutting stress. By positioning the organic film layer to be cut instead of the inorganic film layer, the cutting process is mediated through a more compliant material that can better withstand the mechanical stress of aperture formation.
2Strength
If the inorganic film layers are made thicker to improve protection, then the protective function is enhanced, but the cutting process becomes more difficult and causes cracking
Solution Approach 1:
The patent applies different material properties to different locations in the film stack. The inorganic film layer maintains its thickness and protective function in areas where cutting is not needed, while the organic film layer is positioned specifically in the aperture area to be cut. This local differentiation allows the inorganic layer to remain thick for protection without compromising manufacturability.
Solution Approach 2:
By segmenting the film layers into organic and inorganic components with distinct roles, the patent allows the inorganic layer to be optimized for protection (thicker) while the organic layer handles the cutting operation. This segmentation resolves the contradiction between thickness for protection and ease of cutting.
3Manufacturing precision
If the aperture area is cut through all film layers, then the functional hole is formed, but film peeling and dark spots occur due to stress concentration
Solution Approach 1:
The organic film layer serves as a stress-absorbing intermediary during the cutting process. By positioning this layer to be cut instead of the inorganic film layers, the mechanical stress and thermal stress are absorbed by the more compliant organic material, preventing stress concentration that would otherwise cause film peeling and dark spots in the inorganic layers.
Solution Approach 2:
The patent converts the potential harm of cutting through multiple layers into a benefit by strategically positioning the organic film layer to absorb the cutting stress. The organic material's compliance and ability to deform without cracking transform the harmful cutting process into a beneficial stress-absorption mechanism that protects the inorganic film layers from damage.
Data Source
AI summary
A display substrate is provided. The display substrate includes a plurality of organic material film layers and a plurality of inorganic material film layers, wherein the plurality of organic material film layers and the plurality of inorganic material film layers are provided with a functional hole, and the functional hole is disposed in an aperture area of the display substrate. An organic material is provided on an inner side wall of the functional hole in at least one of the inorganic material film layers.