Display Substrate Light-Absorption Layout for Precise Bending
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Solution Overview
Problem
Existing Micro/Mini-LED display substrates face challenges in bending due to complex structures and large film thickness, leading to inaccurate laser lift-off processes and abnormal display effects during splicing, resulting in increased splicing gaps and reduced mechanical rigidity.
Innovation Solution
A display substrate design with a rigid substrate, a flexible film layer, and strategically placed light absorption portions to absorb laser light, allowing for precise bending and reducing the need for high-precision alignment during laser lift-off, thereby minimizing lift-off errors and maintaining display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a bending region is arranged between the display region and bonding region to enable splicing, then the splicing gap can be reduced, but the display substrate becomes difficult to bend due to complex structure and large film layer thickness
Solution Approach 1:
The patent divides the bending region into multiple layers with different properties: a first bending region with a first flexible film layer and a second bending region with a second flexible film layer of different thickness. This segmentation allows each layer to contribute differently to the overall bending performance, enabling the substrate to bend more easily while maintaining structural integrity for reduced splicing gaps.
Solution Approach 2:
The patent applies local quality by creating regions with different film layer thicknesses and material properties within the bending region. The first flexible film layer has a first thickness in a first region and a second thickness in a second region, with the second thickness being greater than the first. This local variation in thickness and material properties optimizes bending characteristics in different areas while maintaining overall structural rigidity where needed.
2Ease of manufacture
If laser lift-off technology is used to form openings in the bending region, then the bending process can be simplified, but the complex structure and large film thickness cause inaccurate laser lift-off and abnormal display effects
Solution Approach 1:
The patent changes the optical parameters of the flexible film layers by using materials with different light absorption characteristics. The first flexible film layer includes a first light absorption layer and the second flexible film layer includes a second light absorption layer with different absorption coefficients for the laser wavelength. This parameter change ensures that the laser energy is selectively absorbed at the correct interfaces, enabling accurate lift-off despite the multi-layer complex structure.
Solution Approach 2:
The patent introduces light absorption layers as intermediary elements between the laser source and the flexible film layers. These light absorption layers act as mediators that control the distribution of laser energy, ensuring that the laser lift-off process occurs at the intended interfaces while preventing energy penetration into deeper layers, thus improving manufacturing precision.
3Ease of operation
If the rigid substrate has an opening in the bending region to expose the flexible film layer, then bending can be enabled, but buffer adhesive may overflow during bending due to insufficient structural support
Solution Approach 1:
The patent uses flexible film layers with controlled thickness variations to create a structure that can bend without causing adhesive overflow. The first flexible film layer has a first thickness and the second flexible film layer has a second thickness greater than the first, creating a gradient structure that distributes bending stresses appropriately and prevents buffer adhesive from overflowing during the bending process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate bending of the display substrate without overflowing buffer adhesive, reducing splicing gaps and maintaining display quality, while allowing for efficient splicing of large-size LED displays from smaller substrates.
Implementation Method 1
a first light absorption portion in the display region and on one side of the display region close to the bending region; and the first light absorption portion is on one side of the rigid substrate facing away from the flexible film layer or on one side of the rigid substrate facing the flexible film layer
Data Source
AI summary
Disclosed in the present application are a display substrate, a preparation method therefor, and a display device. The display substrate includes a rigid substrate, and a flexible film layer and a display function layer that are sequentially stacked on the rigid substrate. The rigid substrate is provided with an opening at a bending region to expose the flexible film layer in the bending region. The display substrate further includes a first light absorption portion in a display region and is on the side of the display region close to the bending region. The first light absorption portion is on the side of the rigid substrate facing away from the flexible film layer or is between the rigid substrate and the flexible film layer.