Display Substrate Blocking Conductive Layer for Interference Shielding

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Solution Overview

Problem

Existing display substrates are affected by external interference electric fields, which interfere with the driving electric field and degrade the display performance of liquid crystal display devices.

Innovation Solution

A display substrate with a flexible circuit board and a blocking conductive layer that blocks external interference electric fields, including a black conductive layer and insulation layer, is designed to protect the transistor structure and conductive wire structures, while a heat dissipation layer manages temperature issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a blocking conductive layer is added to shield external interference electric fields, then the display performance is improved, but the device complexity increases

Engineering Contradiction:
Improvedisplay performanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The blocking conductive layer is integrated within the flexible circuit board structure, nesting the shielding function inside the existing circuit board layers rather than adding a separate external shielding component. This reduces overall device complexity while maintaining the anti-interference capability.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The flexible circuit board is designed to serve multiple functions: electrical connection, mechanical flexibility, and electromagnetic shielding. By making the circuit board multi-functional, the patent avoids adding separate components for each function, thereby improving reliability without proportionally increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If the flexible circuit board is bent to accommodate spatial layout, then the adaptability is improved, but the manufacturing precision deteriorates

Engineering Contradiction:
Improvespatial layout flexibilityVSAvoidalignment precision
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The circuit board is designed with flexible sections that can be bent to different angles and positions, transforming a static rigid structure into a dynamic adaptable one. This allows the same manufacturing process to produce boards that can be configured for different spatial layouts without requiring different manufacturing precision.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The flexible circuit board is divided into multiple sections with different flexibility characteristics. Some sections are designed to be rigid for maintaining electrical connections, while other sections are made flexible for bending and spatial adaptation. This segmentation allows each part to be manufactured with appropriate precision requirements.

Inventive Principle:
Principle #1Segmentation

3Reliability

If a heat dissipation layer is added to manage temperature, then the reliability is improved, but the device complexity increases

Engineering Contradiction:
Improvetemperature managementVSAvoidlayer structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The heat dissipation layer is merged with the flexible circuit board structure, combining the thermal management function with the existing electrical connection structure. This integration approach improves reliability through effective heat dissipation while minimizing the increase in device complexity by using a unified structure rather than separate components.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively shields the display substrate from external interference electric fields, ensuring improved display performance and efficient heat dissipation, thereby enhancing the reliability and efficiency of liquid crystal display devices.

Implementation Method 1

a blocking conductive layer on the flexible circuit board and configured to block an interference electric field in an external environment from affecting the display substrate

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

a heat dissipation layer on a second surface of the flexible circuit board... the heat dissipation layer further covers at least a portion of the transistor structure

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11644704B2Display substrate, method of fabricating the same, and display panel
Publication Date: 2023.05.09 CHENGDU BOE OPTOELECTRONICS TECH CO LTD
  • US11644704B2 patent drawing
  • US11644704B2 patent drawing
  • US11644704B2 patent drawing

AI summary

The disclosure provides a display substrate and a method of fabricating the same, and a display panel. The display substrate includes: a substrate; a transistor structure on the substrate; a flexible circuit board having one end coupled to the transistor structure, and the other end capable of being bent to a side of the substrate away from the transistor structure; and a blocking conductive layer on the flexible circuit board and configured to block an interference electric field in an external environment from affecting the display substrate.