Display Substrate Loading and Bonding Apparatus
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing process of display devices is hindered by inefficiencies in loading and bonding substrates, leading to increased process time and complexity.
Innovation Solution
An apparatus and method that utilize a pressurizing portion and vacuum portion to efficiently load and bond substrates by moving units between positions to overlap and separate, allowing for simultaneous loading and bonding of substrates while maintaining a sealed space for vacuum formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are loaded and bonded sequentially in traditional manufacturing processes, then the bonding process can be completed, but the process time and complexity increase
Solution Approach 1:
The patent combines multiple substrate loading operations into a single unified process. Multiple substrates are loaded simultaneously onto a single support portion, and the bonding process integrates loading, positioning, and bonding operations into one coordinated sequence, eliminating the need for separate loading and bonding steps for each substrate.
Solution Approach 2:
Substrates are pre-loaded onto the support portion before the bonding process begins. The support portion with multiple substrates attached is then moved as a unit to the bonding position, allowing preparation operations to be completed in advance and reducing the actual bonding time.
2Productivity
If multiple substrates are handled individually, then each substrate can be processed, but the device complexity and operation complexity increase
Solution Approach 1:
Multiple substrates are combined on a single support portion, allowing them to be transported and positioned together as one unit. The bonding process applies pressure to all substrates simultaneously through the support portion, reducing the number of separate handling operations and simplifying the overall process.
Solution Approach 2:
The support portion serves multiple functions: it holds multiple substrates during loading, transports them to the bonding position, and applies pressure during bonding. This multi-functional component reduces the need for separate mechanisms for each substrate, simplifying the overall device architecture.
3Productivity
If substrates are loaded close to the pressurizing portion, then loading efficiency improves, but vacuum sealing becomes difficult
Solution Approach 1:
The support portion is designed as a separate modular component that can be positioned at an optimal distance from the pressurizing portion. This segmentation allows the loading area to be separated from the bonding area, enabling efficient substrate placement while maintaining proper spacing for vacuum sealing and pressure application.
Solution Approach 2:
The support portion acts as an intermediary between the loading mechanism and the pressurizing portion. It receives substrates at a convenient location, then moves them to the bonding position where vacuum sealing and pressure application occur, mediating between the conflicting requirements of loading efficiency and sealing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the loading and bonding process, improving efficiency and reducing time by allowing for simultaneous handling and bonding of multiple substrates, thereby enhancing the overall manufacturing process.
Implementation Method 1
a vacuum portion arranged apart from the first unit in the first direction, where, when the first support portion is in the second position, the vacuum portion is docked to the first chamber
Implementation Method 2
the pressurizing portion may apply pressure to at least one selected from the first chamber and the second chamber
Data Source
AI summary
An apparatus for manufacturing a display device includes a pressurizing portion and a first unit arranged apart from the pressurizing portion in a first direction when the first unit is in a first position, where the first unit includes a first support portion movable in the first direction, a first chamber arranged on the first support portion, where a first substrate is loaded in the first chamber, and a second chamber arranged on the first chamber, where a second substrate is loaded in the second chamber, and the first support portion moves between the first position in which the first support portion is located apart from the pressurizing portion in the first direction and a second position in which the first support portion and the pressurizing portion overlap each other in a plan view.