Display Substrate Bonding Area Dummy Traces Surface Roughness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-resolution display panels face challenges in bonding processes due to surface roughness differences between pad arrays, leading to inconsistent bonding effects and reduced manufacturing yield.
Innovation Solution
A display substrate design with a bonding area featuring multiple first and second pad arrays, where dummy traces are strategically placed between pads to balance surface roughness, ensuring consistent pressure distribution and improved bonding stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple layers of pads are disposed for routing design in high-resolution display panels, then the process and cost matching is improved, but the surface roughness becomes inconsistent in the bonding area
Solution Approach 1:
The patent introduces dummy pads with different surface roughness characteristics in different regions of the bonding area. Specifically, dummy pads are added in areas with lower surface roughness to increase the overall surface roughness in those regions, while areas with higher surface roughness maintain their original pad configuration. This creates a uniform distribution of surface roughness across the entire bonding area, resolving the inconsistency caused by multiple pad layers.
2Ease of manufacture
If the same pressure is applied during driving chip bonding, then the bonding process is simplified, but the bonding effect becomes inconsistent across different areas
Solution Approach 1:
The patent modifies the bonding area by strategically placing dummy pads in regions with lower surface roughness to create a more uniform surface roughness distribution across the entire bonding area. This allows the driving chip to achieve consistent bonding effects across all areas when the same pressure is applied, eliminating the need for complex pressure adjustment mechanisms while maintaining high bonding reliability.
3Manufacturing precision
If multiple pad arrays are arranged for high-resolution display, then the display quality is improved, but the bonding stability is reduced due to surface roughness differences
Solution Approach 1:
The patent introduces dummy pads in specific regions of the bonding area where surface roughness is lower. These dummy pads have surface roughness characteristics that match the higher roughness areas, creating a uniform distribution of surface roughness across the entire bonding area. This uniformity ensures that the driving chip achieves stable and consistent bonding across all pad arrays, maintaining high bonding reliability while supporting high-resolution display requirements.
Data Source
AI summary
Provided are a display substrate, a display panel and a display device. The display substrate includes a display area, a bezel area and multiple first signal lines. The bezel area includes a bonding area, the bonding area includes a first area and a second area, the first area includes first pads, and the second area includes second pads. The first signal lines are electrically connected to the first pads. Each of at least part of the first signal lines extends between respective two adjacent first pads. The second pads are dummy pads, or part of the second pads are electrically connected to a second signal line. The bonding area further includes multiple dummy traces, and at least part area of a dummy trace is disposed between two adjacent first pads, and/or between two adjacent second pads, and/or between a first pad and a second pad adjacent to each other.