Display Substrate Bonding Pads Merged for Simultaneous FPC Connection
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Solution Overview
Problem
The existing bonding process for on-cell touch display panels is inefficient, requiring multiple bonding steps and resulting in wasted time and labor, as well as a lower mass production yield due to the need for FPCs to cross layers to connect bonding pads.
Innovation Solution
A display substrate and panel design where the first and second bonding pads are located on the same transparent substrate, allowing simultaneous bonding to an FPC without crossing layers, and via holes are formed to connect electrodes across substrates, enabling efficient connection of touch and display electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If bonding pads of display electrode and touch electrode are located in different layers, then each electrode can be independently connected, but multiple FPC bonding steps are required, wasting time and labor
Solution Approach 1:
The patent merges the bonding pads of the display electrode and touch electrode onto the same substrate layer. This allows both bonding operations to be performed simultaneously in a single bonding step, eliminating the need for multiple sequential bonding processes and reducing overall bonding time
Solution Approach 2:
The patent repositions the bonding pads from a three-dimensional arrangement across different layers to a two-dimensional arrangement on the same plane. This dimensional change enables simultaneous access to both bonding pads by the FPC, eliminating the need for layer-crossing operations
2Adaptability or versatility
If FPC needs to cross layer to connect bonding pads, then connection between touch electrode and PCB is achieved, but mass production yield decreases
Solution Approach 1:
The patent extracts the bonding pad functions from their original distributed locations across different layers and consolidates them onto a single substrate layer. This extraction eliminates the complexity of layer-crossing FPC connections while maintaining all necessary connection capabilities
Solution Approach 2:
The patent creates a universal bonding interface on the substrate layer that can simultaneously accommodate both display electrode bonding and touch electrode bonding. This multi-functional bonding area eliminates the need for separate bonding procedures and simplifies the overall connection process
Data Source
AI summary
A display substrate, a display panel, a display device and a bonding method are provided. The display panel substrate includes: a transparent substrate comprising a display area and a bonding area located at the periphery of the display area. The bonding area is provided with a first bonding pad connected with a touch electrode, and a second bonding pad connected with a display electrode. One of the touch electrode and the display electrode is located in the display area, and the other electrode is located on another transparent substrate facing to the transparent substrate.