Display Substrate Bonding Pattern for Lower LED Voltage Drop
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LED display apparatuses have high power consumption, which limits their efficiency and reliability.
Innovation Solution
A display substrate with a driving backplane and a light-emitting device layer featuring stacked vertical light-emitting diodes and a bonding pattern that reduces resistance by connecting transparent electrodes, along with an encapsulation substrate with a bonding pattern that enhances electrical contact, thereby reducing power consumption and improving luminous efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If traditional LED display apparatuses are used, then light emission function is achieved, but power consumption is high
Solution Approach 1:
The patent divides the light-emitting structure into multiple stacked vertical LED units (first vertical LED, second vertical LED, etc.) connected in series. Each LED unit has its own electrode connections, allowing independent optimization of current paths. This segmentation enables reduced resistance in each segment, lowering overall power consumption while maintaining reliability through modular architecture.
Solution Approach 2:
The patent transitions from traditional planar LED structures to vertical stacked configurations. By adding the vertical dimension with multiple LED layers stacked above each other, the current path is optimized to reduce resistance. The transparent electrodes are arranged in vertical columns connecting through the stacked layers, creating efficient three-dimensional current distribution that reduces power consumption.
2Loss of energy
If vertical stacked light-emitting diodes are implemented, then luminous efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The bonding patterns in the patent serve multiple functions simultaneously: they provide electrical connection between stacked LED units, act as structural support layers, and function as current distribution paths. The transparent electrodes serve both as electrical contacts and as light-transmitting elements. This multi-functionality reduces the need for separate components, simplifying manufacturing despite the vertical stacked architecture.
Solution Approach 2:
The patent merges the electrical connection function and structural support function into single integrated bonding patterns. The first bonding pattern connects the first transparent electrode to the second transparent electrode while also providing structural stability. This consolidation of functions reduces the number of discrete components and manufacturing steps, making the vertical stacked structure more manufacturable.
3Power
If transparent electrodes are connected through bonding patterns, then voltage drop is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The bonding patterns act as intermediary structures between stacked LED units and transparent electrodes. These bonding layers provide a buffer zone that accommodates manufacturing tolerances while ensuring reliable electrical connection. The bonding patterns are designed with sufficient area and conductive material to compensate for alignment variations, reducing the impact of manufacturing precision limitations on voltage drop.
Solution Approach 2:
The patent optimizes parameters of the bonding patterns including material composition, layer thickness, and lateral dimensions to balance electrical performance and manufacturing feasibility. By adjusting the conductive material properties and geometric parameters of bonding patterns, the design achieves low voltage drop while accommodating reasonable manufacturing precision levels through parameter optimization rather than requiring extreme precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces voltage drop, enhances luminous efficiency, and decreases power consumption, leading to improved display properties and longer device lifespan.
Implementation Method 1
a first bonding pattern at least located between the plurality of transparent electrodes. The first bonding pattern is electrically connected to at least one transparent electrode
Implementation Method 2
Light-emitting diodes are semiconductor components that can convert electrical energy into light within a specific wavelength range. The luminous principle of the light-emitting diode is recombination of electrons and holes to emit light.
Data Source
AI summary
A display substrate includes a driving backplane, and a light-emitting device layer located on a side of the driving backplane. The light-emitting device layer includes a plurality of light-emitting units; a plurality of transparent electrodes which are located on surfaces of the plurality of light-emitting units away from the driving backplane and electrically connected to the light-emitting units; and a first bonding pattern which is at least located between the plurality of transparent electrodes. The first bonding pattern is electrically connected to at least one transparent electrode.