Display Device Substrate Bracket Heat Dissipation

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Solution Overview

Problem

The challenge in slimming flat panel displays, such as OLED and LCDs, is effectively dissipating heat generated by downsized and highly integrated printed circuit boards (PCBs) in confined spaces, which affects the adjacent display panel regions.

Innovation Solution

A display device design featuring a substrate bracket with a bracket main body, coupling ledge, and hook portion made from materials with higher thermal conductivity than the PCB and display panel, along with a double-sided adhesive member and heat dissipating cushion, securely positions the PCB at the rear of the display panel while utilizing patterns of protrusions and depressions for enhanced heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If PCBs are downsized and highly integrated to minimize display thickness, then device slimness is improved, but heat dissipation becomes more difficult

Engineering Contradiction:
Improvedisplay thicknessVSAvoidheat dissipation
Core Design Contradiction:
Length of stationary objectVSTemperature

Solution Approach 1:

The patent introduces a heat dissipation plate positioned between the PCB and display panel, creating a new thermal management dimension. This plate conducts heat away from the confined PCB space through its larger surface area, effectively dissipating heat in a direction perpendicular to the display thickness while maintaining the slim profile.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat dissipation plate serves as an intermediary component between the heat-generating PCB and the display panel. It mediates the thermal interaction by absorbing heat from the PCB and transferring it to a larger thermal mass or external environment, preventing direct heat transfer to the display panel.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If heat dissipation structures are added to manage PCB heat, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoidstructure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation plate performs multiple functions simultaneously: it serves as a thermal management component, a structural support element, and a spacer maintaining the PCB position. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving effective heat dissipation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Length of stationary object

If PCB is positioned close to display panel to reduce thickness, then device slimness is improved, but heat affects display panel region

Engineering Contradiction:
Improvedisplay thicknessVSAvoidheat effect on display panel
Core Design Contradiction:
Length of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The heat dissipation plate acts as a thermal barrier and intermediary between the PCB and display panel. It intercepts heat from the PCB before it can reach the display panel, conducting the heat away through its own structure and reducing the thermal impact on the display panel region.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat dissipation plate extracts heat from the confined space between the PCB and display panel. By providing an alternative thermal pathway, it removes the harmful heat accumulation from the region proximate to the display panel, protecting it from thermal damage while maintaining close proximity for thickness reduction.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design securely positions the PCB and effectively dissipates heat, reducing temperature effects on the display panel and improving image quality by minimizing heat-related issues in slim, high-integration display devices.

Implementation Method 1

the substrate bracket is formed including one or more of a metal, ceramic, and resin having a thermal conductivity that is comparatively higher than the PCB and the display panel

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a double-sided adhesive member disposed between the display panel and the substrate bracket, and attaching the substrate bracket to the rear of the display panel

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentEP2635101B1Display device
Publication Date: 2020.04.08 SAMSUNG DISPLAY CO LTD
  • EP2635101B1 patent drawingFigure 1
  • EP2635101B1 patent drawingFigure 2
  • EP2635101B1 patent drawingFigure 3

AI summary

A display device is disclosed, wherein the device includes a display panel, a printed circuit board (PCB) disposed opposite to a rear of the display panel, and supplying a driving signal to the display panel, and a substrate bracket attached to an edge of the rear of the display panel, and supporting the PCB. The substrate bracket includes a bracket main body portion facing the PCB, a bracket coupling ledge bent and extending from a top of the bracket main body portion and enclosing a top of the PCB, and a bracket hook portion protruding from a bottom of the bracket main body portion in a direction toward the PCB, and supporting a bottom of the PCB.