Display Substrate Conductive Patterns for Chip Attachment
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Solution Overview
Problem
In the manufacturing of liquid crystal display devices, the removal of the organic layer to attach a driving chip can damage the data metal pattern, leading to parasitic capacitance issues between the pixel electrode and the gate or data lines, which affects the display substrate's performance.
Innovation Solution
The display substrate design includes a switching element connected to a gate line and data line, with a pad part and conductive patterns formed from the same material as the gate line, and an organic layer that partially exposes these patterns, ensuring that a third conductive pattern covers the partially exposed second conductive pattern to prevent damage and reduce parasitic capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the organic layer is removed to attach a driving chip, then the driving chip can be properly attached, but the data metal pattern may be damaged
Solution Approach 1:
A protective conductive pattern is formed over the data metal pattern before the organic layer removal process. This preliminary protective structure prevents damage to the data metal pattern during subsequent manufacturing steps, particularly during driving chip attachment processes that require organic layer removal.
Solution Approach 2:
The protective conductive pattern acts as an intermediary layer between the data metal pattern and the external environment during driving chip attachment. This intermediate structure shields the vulnerable data metal pattern from mechanical damage while allowing the driving chip to be properly attached to the display substrate.
2Area of stationary object
If the pixel electrode overlaps with the gate line or data line, then the display area can be maximized, but parasitic capacitance is generated
Solution Approach 1:
The harmful effect of parasitic capacitance is extracted and isolated by introducing a protective conductive pattern that is electrically connected to the data metal pattern. This separate conductive structure acts as a shield, capturing and managing the parasitic capacitance effects without allowing them to directly affect the pixel electrode performance.
Solution Approach 2:
The protective conductive pattern serves as an intermediary electromagnetic shield between the pixel electrode and the gate line or data line. Even though these conductors overlap to maximize display area, the intermediate protective layer reduces parasitic capacitance coupling by providing a controlled electrical path that manages the electromagnetic interaction.
3Ease of manufacture
If the organic layer is completely removed for driving chip attachment, then the driving chip can be attached, but manufacturing processes become more complex
Solution Approach 1:
The protective conductive pattern is formed in advance during the standard manufacturing process, before driving chip attachment. This preliminary structure is integrated into the existing manufacturing flow, allowing driving chip attachment to proceed without requiring complete organic layer removal, thereby simplifying the overall manufacturing process.
Solution Approach 2:
The protective conductive pattern serves multiple functions: it protects the data metal pattern from damage, manages parasitic capacitance, and enables simplified driving chip attachment. This multi-functional structure eliminates the need for complete organic layer removal, reducing manufacturing process complexity while achieving multiple objectives.
Data Source
AI summary
A display substrate includes a switching element disposed in a display region that is electrically connected to a gate line, a data line, and a first electrode in a peripheral region adjacent to the display region that includes a first conductive pattern formed from a first conductive layer that includes a same material as the gate line, a first line connecting part disposed in the peripheral region that includes the first conductive pattern, a second conductive pattern that overlaps the first conductive pattern and formed, an organic layer that partially exposes the second conductive pattern, and a third conductive pattern electrically connected to the second conductive pattern that contacts the partially exposed second conductive pattern, and a fourth conductive pattern that electrically connects the first conductive pattern of the pad part and the third conductive pattern of the first line connecting part.