Display Substrate Serial-to-Parallel Converter Integration
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Solution Overview
Problem
The high cost and limited yield of display panels due to the costly bonding process of driving chips on the display panel, which increases production costs and reduces production efficiency.
Innovation Solution
A display substrate with a peripheral area containing interface circuits, serial-to-parallel converters, and display drivers that convert serial display data into parallel data to drive sub-pixels, eliminating the need for external driving ICs and directly integrating the driving circuit on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If driving chips are bonded on the display panel, then the display panel can be driven, but the production cost increases and production yield decreases
Solution Approach 1:
The patent merges the driving circuit functionality directly into the display substrate by integrating display drivers and serial-to-parallel converters within the substrate structure itself, eliminating the need for separate bonding operations. This integration consolidates multiple components into a single manufactured unit, thereby reducing production costs and improving yield while maintaining driving functionality.
Solution Approach 2:
The patent extracts the driving circuit functions from external bonded chips and relocates them directly into the display substrate. By taking out the bonding process and embedding the driving functionality within the substrate's peripheral area, the patent eliminates the costly and yield-limiting bonding step while preserving all necessary driving capabilities.
2Productivity
If driving chips are bonded on the display panel, then the display panel can be driven, but the bonding process is costly and time-consuming
Solution Approach 1:
The patent combines the driving circuit functionality directly within the display substrate, merging what were previously separate components (driving chips and substrate) into a single integrated unit. This eliminates the bonding process entirely, significantly improving production efficiency and reducing manufacturing complexity.
Solution Approach 2:
The patent performs preliminary integration of the driving circuits and serial-to-parallel converters during the substrate manufacturing process itself, rather than requiring post-manufacturing bonding operations. This preliminary action embeds the driving functionality into the substrate before final assembly, streamlining production and eliminating costly bonding steps.
Data Source
AI summary
A display substrate has a display area and a peripheral area around the display area. The display substrate includes a plurality of sub-pixels arranged in an array in the display area, and an interface circuit, at least two serial-to-parallel converters and at least one display driver that are in the peripheral area. The interface circuit is configured to receive target data including a plurality of serial display data. A serial-to-parallel converter in the at least two serial-to-parallel converters is used to convert the plurality of serial display data into parallel display data. The serial-to-parallel converter is electrically connected to one display driver to provide the parallel display data to the display driver. The display driver is used to output display driving signals to a plurality of sub-pixels according to the parallel display data.