Display Substrate Conductive Layer for Copper Diffusion Blocking
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Solution Overview
Problem
The easy diffusion characteristics of copper in display technologies lead to performance degradation in display products, as copper diffuses to other film layers, affecting the overall product characteristics.
Innovation Solution
A display substrate with a metal conductive layer comprising a core conductive layer and a functional conductive layer, where the functional conductive layer includes a first diffusion barrier metal material and at least one adhesion force enhancing metal material, configured to block copper diffusion and enhance adhesion between the conductive layer and photoresist.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper is used as the conductive metal material, then electrical conductivity is improved, but copper diffusion to other film layers occurs causing performance degradation
Solution Approach 1:
A functional conductive layer is introduced as an intermediary between the copper core conductive layer and the photoresist. This functional layer contains diffusion barrier metal materials that prevent copper atoms from migrating to adjacent layers while maintaining electrical conductivity, thus resolving the contradiction between using copper for its conductivity and preventing its harmful diffusion
Solution Approach 2:
The functional conductive layer is constructed as a composite material containing multiple metal materials including diffusion barrier metals and adhesion force enhancing metals. This composite structure combines the benefits of copper conductivity with the protective properties of diffusion barrier materials and the adhesion properties of high-surface-energy metals, simultaneously addressing conductivity, diffusion prevention, and adhesion requirements
2Reliability
If conventional metal materials are used in the conductive layer, then electrical conductivity is achieved, but adhesion force with photoresist is insufficient leading to false etching and defects
Solution Approach 1:
The surface energy parameter of the functional conductive layer is specifically optimized by incorporating adhesion force enhancing metal materials with surface energy greater than 400 mJ/m2. This parameter change ensures sufficient adhesion between the conductive layer and photoresist, preventing false etching and manufacturing defects while maintaining the electrical conductivity provided by the copper core layer
Solution Approach 2:
The functional conductive layer uses a composite material system that combines diffusion barrier metals with adhesion force enhancing metals. This composite approach allows simultaneous optimization of multiple properties: electrical conductivity from copper, diffusion prevention from barrier metals, and adhesion to photoresist from high-surface-energy metals, resolving the contradiction between conductivity and adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the defective rate of disconnection defects and improves oxidation resistance, ensuring better adhesion and preventing false etching and defects in the display substrate.
Implementation Method 1
a first diffusion barrier metal material configured to block diffusion of the conductive metal material
Implementation Method 2
the at least one first adhesion force enhancing metal material is configured to enhance an adhesion force between the functional conductive layer and a photoresist
Implementation Method 3
a surface energy of any of the at least one first adhesion force enhancing metal material is less than or equal to 325 mJ/m2
Implementation Method 4
a first oxidation resistance metal material configured to enhance an oxidation resistance performance of the functional conductive layer
Data Source
AI summary
A display substrate, including: a base substrate; and a metal conductive layer, located at a side of the base substrate, and including a core conductive layer and a functional conductive layer laminated along a direction away from the base substrate; a material of the core conductive layer includes a conductive metal material; a material of the functional conductive layer includes a first diffusion barrier metal material and a first adhesion force enhancing metal material, wherein the first diffusion barrier metal material is configured to block diffusion of the conductive metal material, and the first adhesion force enhancing metal material is configured to enhance an adhesion force between the functional conductive layer and a photoresist used in a patterning process of the functional conductive layer; a surface energy of any of first adhesion force enhancing metal materials is less than or equal to 325 mJ/m2.