Display Substrate Cutting Device with Buffer and Alignment
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Solution Overview
Problem
Existing display device manufacturing processes face challenges in efficiently cutting mother substrates into cell units without damaging the substrates or affecting the display panels, particularly in ensuring precise alignment and effective cutting across the entire width of the substrate in a single operation.
Innovation Solution
A cell cutting device is designed with a fixing unit, a cutter with a length equal to or greater than the substrate width, a cutter driving unit for linear movement, and a buffer member to support the substrate during cutting, along with alignment cameras and alignment members for precise alignment and control, allowing for efficient cutting of mother substrates into cell units while minimizing damage and ensuring accurate alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a cutter is used to cut the mother substrate, then the substrate can be separated into cell units, but the substrate may be damaged or the display panel may be affected
Solution Approach 1:
A buffer member is introduced as an intermediary element positioned between the cutter and the mother substrate. This buffer member receives the cutting force from the cutter and transmits it to the substrate in a controlled manner, preventing direct impact damage while enabling effective cutting separation of the substrate into cell units
Solution Approach 2:
The buffer member is positioned in advance at the cutting location to cushion and absorb the impact force before the cutter contacts the substrate. This pre-positioned cushioning mechanism protects the fragile substrate and display panel from damage during the cutting process
2Manufacturing precision
If the cutter length is increased to cover the entire substrate width, then cutting accuracy is improved, but device complexity increases
Solution Approach 1:
The cutting operation is segmented into multiple sequential passes rather than requiring a single long cutter. The cutter drives unit moves the cutter in steps across the substrate width, with each pass covering a portion of the cutting path. This segmentation allows the use of a shorter, simpler cutter while achieving complete coverage through coordinated movement
Solution Approach 2:
The cutting approach transitions from a single-dimension (long cutter spanning entire width) to multi-dimensional solution combining a shorter cutter with linear movement along the substrate length and rotational capability. This dimensional expansion allows accurate cutting without requiring an excessively long cutter
3Speed
If the cutter moves vertically to cut through the substrate, then cutting speed is improved, but alignment control becomes more difficult
Solution Approach 1:
Alignment cameras are positioned to monitor the cutter position and substrate alignment in real-time during the vertical cutting motion. The camera system provides feedback signals to the control unit, which adjusts the cutter driving unit to maintain precise alignment. This closed-loop feedback system enables fast vertical cutting while preserving accurate alignment control
Solution Approach 2:
The mechanical alignment control system is supplemented or replaced with an optical measurement system (alignment cameras). Instead of relying solely on mechanical positioning mechanisms, the system uses optical detection to monitor and control alignment, enabling faster cutting speeds while maintaining precision through non-contact measurement
Data Source
AI summary
A cell cutting device that cuts a mother substrate for display devices includes a fixing unit configured to move in a state where the mother substrate for display devices is fixed on the fixing unit, a cutter configured to perform a cutting process on the mother substrate for display devices and the cutter faces a surface of the mother substrate during the cutting process, a cutter driving unit driving the cutter in a state where the cutter is fixed thereon, and a buffer member arranged on another surface of the mother substrate to correspond to the cutter. The other surface is opposite the surface facing the cutter.