Display Substrate Depth Camera Integration

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing depth cameras are difficult to miniaturize and are costly due to their complex optical and electronic components, making them less accessible and flexible for consumer use.

Innovation Solution

A display substrate with a depth camera integrated in a non-active region, featuring an infrared light emitting device, diffractive optical elements, and an infrared photosensitive device, which enables miniaturization and integration into display panels, reducing cost and thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional depth camera architectures (binocular stereo vision, TOF, structured light) are used, then depth information acquisition capability is achieved, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improvedepth information acquisitionVSAvoidoptical and electronic components
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines the infrared light emitting device and infrared photosensitive device into a single display substrate, integrating the depth camera functionality with the display panel. This merging eliminates the need for separate depth camera modules and reduces overall device complexity while maintaining depth measurement capability through the coordinated operation of these integrated components

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The display substrate serves dual functions: it acts as both the display panel and the depth camera platform. The infrared light emitting device and infrared photosensitive device are integrated into the same substrate that provides visual display, enabling the display panel to perform both image display and depth information acquisition functions simultaneously

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If traditional depth camera architectures are used, then depth measurement functionality is achieved, but manufacturing cost increases

Engineering Contradiction:
Improvedepth information acquisitionVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

By merging the depth camera components with the display substrate manufacturing process, the patent achieves economies of scale. The infrared light emitting device and infrared photosensitive device are fabricated using the same semiconductor manufacturing processes as the display panel, eliminating the need for separate assembly lines and reducing per-unit manufacturing costs

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The display substrate manufacturing process itself provides the infrastructure and capabilities needed to manufacture the depth camera components. The same fabrication facilities, materials, and processes used for creating the display panel are leveraged to create the infrared emitting and sensing elements, making the manufacturing system self-sufficient for producing both functions

Inventive Principle:
Principle #25Self-service

3Area of stationary object

If display panel area is maximized, then display quality is improved, but available space for depth camera components decreases

Engineering Contradiction:
Improvedisplay areaVSAvoidintegration of depth camera
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent merges the depth camera components directly into the display substrate structure, eliminating the need for separate mounting space. The infrared light emitting device and infrared photosensitive device are fabricated in the same planar substrate as the display pixels, allowing full utilization of the display area without sacrificing space for additional depth camera components

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution allows for the acquisition of depth information while reducing manufacturing costs and panel thickness, making the technology more accessible and flexible for consumer applications.

Implementation Method 1

an infrared light emitting device that emits infrared light and is disposed on the substrate

Methodology Applied
Scientific EffectLight Emitting Diode: Light Emitting Diode

Implementation Method 2

an infrared light emitting device that emits infrared light

Methodology Applied
Scientific EffectInfrared Radiation: Infrared Radiation

Implementation Method 3

a diffractive optical element that is disposed on the infrared light emitting device and is used to transmit the infrared light emitted from the infrared light emitting device to an object

Methodology Applied
Scientific EffectDiffraction: Diffraction

Implementation Method 4

an infrared photosensitive device that is disposed on the substrate and receives the infrared light reflected by the object

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Data Source

PatentUS10866648B2Display substrate and method for manufacturing the same
Publication Date: 2020.12.15 BOE TECHNOLOGY GROUP CO LTD
  • US10866648B2 patent drawing
  • US10866648B2 patent drawing
  • US10866648B2 patent drawing

AI summary

The present disclosure relates to a display substrate. The display substrate includes an active region and a non-active region, and a depth camera is disposed in the non-active region. The depth camera includes at least one receiving unit and a plurality of diffractive units. At least a part of the diffractive units includes an infrared light emitting device disposed on the substrate that emits infrared light. The part of the diffractive units includes a diffractive optical element disposed on the infrared light emitting device and used to transmit the infrared light emitted from the infrared light emitting device to an object. The receiving unit includes an infrared photosensitive device disposed on the substrate and used to receive the infrared light reflected by the object.