Display Substrate Cutting and Detachment for Damage-Free Separation
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Solution Overview
Problem
The challenge in manufacturing flexible display devices is supporting elements on thin substrates during the manufacturing process, as existing methods like laser separation are costly and can damage the substrate or display unit.
Innovation Solution
A cutting apparatus and method that includes a stage for a carrier substrate, a cutting unit, and detaching units to separate a base substrate from the carrier substrate by forming edges and using a scribing wheel, allowing for efficient separation without expensive equipment and minimizing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser irradiation is used to separate the base substrate from the carrier substrate, then separation can be achieved, but the substrate or display unit may be damaged and equipment cost increases
Solution Approach 1:
The patent replaces the laser-based separation method with a mechanical cutting system consisting of a cutting unit with a cutting tool that physically separates the base substrate from the carrier substrate along a predetermined cutting line. This mechanical approach eliminates the harmful thermal effects of laser irradiation that could damage the thin substrate or display elements, while still achieving reliable separation through controlled mechanical cutting forces.
2Reliability
If laser irradiation is used to separate the base substrate from the carrier substrate, then separation can be achieved, but equipment cost increases
Solution Approach 1:
The patent employs a mechanical cutting tool that can be replaced or regenerated at low cost, replacing the need for expensive laser equipment. The cutting tool operates along a predetermined cutting line and can be maintained or replaced economically, significantly reducing equipment investment and operational costs while maintaining reliable separation functionality.
3Adaptability or versatility
If thin substrate is used for flexible display device, then flexibility is improved, but support during manufacturing becomes difficult
Solution Approach 1:
The patent performs cutting along a predetermined cutting line before complete separation of the base substrate from the carrier substrate. This preliminary cutting action creates a separation path that guides the detachment process, allowing the thin flexible substrate to be separated without requiring excessive support strength during the entire manufacturing process. The predetermined cutting line acts as a pre-planned separation pathway that minimizes the need for temporary support structures.
4Device complexity
If conventional separation method is used, then manufacturing process is simple, but separation efficiency is low and distortion occurs
Solution Approach 1:
The patent segments the separation process into distinct phases: cutting along a predetermined cutting line to create a separation path, followed by detachment along the cut line. This segmentation allows the thin substrate to be separated in a controlled manner, improving separation efficiency and reducing distortion compared to conventional single-step separation methods, while maintaining reasonable manufacturing process complexity.
Data Source
AI summary
A cutting apparatus includes: a stage on which is disposed a preliminary stacked body from which a cut stacked body having an edge is formed; a cutting unit movable along a first direction corresponding to an extension direction of the edge of the cut stacked body and with which the preliminary stacked body is cut to form the cut stacked body; a first detaching unit movable in a direction forming an acute angle with the first direction and including a first detaching tool which contacts the cut stacked body in detaching of the cut stacked body from the carrier substrate; and a second detaching unit movable in a direction parallel to the first direction and including a second detaching tool which is inserted between the cut stacked body and the carrier substrate in the detaching of the cut stacked body from the carrier substrate.